公开(公告)号：CA1104699A

公开(公告)日：1981-07-07

申请号：CA287711

申请日：1977-09-28

Applicant: IBM

Inventor： MORGAN WILLIAM M ,  HUNTLEY FRANK A

IPC: G02F1/1333 ,  G02F1/01 ,  G02F1/155 ,  G09F9/30 ,  G09F9/35 ,  C23F1/00

Abstract: A matt display electrode in a display device is formed by a chemical treatment of which a first step comprises forming a compound of the surface of the electrode and a second step of removing the compound. In the case of an aluminium electrode the compound is a layer of aluminium oxide-hydroxide. The highly roughened surface resulting from removal or this compound provides excellent scattering of incident light.

公开(公告)号：DD137126A5

公开(公告)日：1979-08-15

申请号：DD20594678

申请日：1978-06-12

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

公开(公告)号：DD136751A5

公开(公告)日：1979-07-25

申请号：DD20341778

申请日：1978-01-25

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C23C5/00

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

公开(公告)号：PL204172A1

公开(公告)日：1978-10-23

申请号：PL20417278

申请日：1978-01-23

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

公开(公告)号：FR2374436A2

公开(公告)日：1978-07-13

申请号：FR7712637

申请日：1977-04-19

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/56

公开(公告)号：DE69300234T2

公开(公告)日：1996-02-29

申请号：DE69300234

申请日：1993-03-03

Applicant: IBM

Inventor： BANKS PETER MICHAEL ,  MORGAN WILLIAM M

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

公开(公告)号：GB2292004A

公开(公告)日：1996-02-07

申请号：GB9415297

申请日：1994-07-29

Applicant: IBM UK ,  HAVANT INT GROUP LTD ,  HAVANT INTERNATIONAL LTD

Inventor： MEDLOCK KATHERINE MARGARET ,  COWBURN ANTHONY R ,  SAVAGE CLIVE PETER ,  MORGAN WILLIAM M

IPC: H01L23/498 ,  H01L23/48

Abstract: An electronic circuit package comprises a carrier substrate 20 e.g. in the form of a flexible circuit, having a plurality of electrical contacts 40 - 45 defined thereon, an integrated circuit device 10 mounted on the substrate including a plurality of terminals 30, 32, 50 - 54 located towards the periphery of the device, the plurality of terminals being individually connected by means of conductive wires 31 to a corresponding electrical contact on the substrate. The package further comprises a conductive path means 150 acting as a conductive bridge between a selected device terminal eg 50 and an associated electrical contact on the substrate 43, the conductive path means comprising a conductive region defined in or on an outward facing surface of the device, the selected terminal eg 50 connected by a first conductive wire 180 to the conductive region 162, 166 which is in turn connected by a second conductive wire 182 to the associated electrical contact 108. The conductive region is advantageously formed in a separate circuit element e.g. a flexible circuit which is bonded onto the surface of the device.

公开(公告)号：GB2292003A

公开(公告)日：1996-02-07

申请号：GB9415296

申请日：1994-07-29

Applicant: IBM UK ,  HAVANT INT GROUP LTD ,  HAVANT INTERNATIONAL LTD

Inventor： MEDLOCK KATHERINE MARGARET ,  COWBURN ANTHONY R ,  SAVAGE CLIVE PETER ,  MORGAN WILLIAM M

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/48

Abstract: The area required for wirebond direct chip attach on a flexible substrate 30 is reduced by countersinking the chip 10. A spacer layer 70 or an indentation in a heatsink 20 may be used to recess a chip 10 relative to a flexible substrate 30. This enables shorter wirebonds 40 and less encapsulation 60 to be employed. A protection layer 50 is applied over a wiring pattern carried by the substrate 30.

公开(公告)号：CA1210733A

公开(公告)日：1986-09-02

申请号：CA415388

申请日：1982-11-12

Applicant: IBM

Inventor： BARCLAY DONALD J ,  VIGAR JAMES M ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56 ,  C25D3/04

Abstract: ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 106

公开(公告)号：CA1209089A

公开(公告)日：1986-08-05

申请号：CA415397

申请日：1982-11-12

Applicant: IBM

Inventor： BARCLAY DONALD J ,  VIGAR JAMES M ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

Abstract: ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS A chromium electroplating electrolyte containing a source of trivalent chormium ions, a complexant, a buffer agent and a sulphur species having S-O or S-S bonds for promoting chromium deposition, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 106