公开(公告)号：CA1099078A

公开(公告)日：1981-04-14

申请号：CA292187

申请日：1977-12-01

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C01C3/20 ,  C25D3/04

Abstract: Chromium or chromium alloys can be plated from an aqueous solution of a chromium (III) thiocyanate complex having at least one ligand other than thiocyanate or water in the inner co-ordination sphere. One complex is a chromium (III) chlorothiocyanate complex which can be prepared by equilibrating chromium chloride with sodium thiocyanate.

公开(公告)号：CA1111369A

公开(公告)日：1981-10-27

申请号：CA303634

申请日：1978-05-18

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

Abstract: Chromium or chromium alloys can be electroplated from an equilibrated aqueous solution of a chromium (III) thiocyanate complex and a buffer rater1al, the buffer material in the equilibrated solution providing one of the ligands for the complex.

公开(公告)号：FR2378108B1

公开(公告)日：1980-02-01

申请号：FR7712638

申请日：1977-04-19

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

公开(公告)号：DE69300234D1

公开(公告)日：1995-08-10

申请号：DE69300234

申请日：1993-03-03

Applicant: IBM

Inventor： BANKS PETER MICHAEL ,  MORGAN WILLIAM M

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

公开(公告)号：CA1209088A

公开(公告)日：1986-08-05

申请号：CA415396

申请日：1982-11-12

Applicant: IBM

Inventor： BARCLAY DONALD J ,  VIGAR JAMES M ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

Abstract: ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS A chromium electroplating electrolyte containing trivalent chromium ions a complexant, a buffer agent and organic compound having a -C=S group or a -C-S group within the molecule for promoting chromium deposition. The complexant is preferably selected so that the stability constant K1 of the chromium complex is in the range 108

公开(公告)号：FR2394621A2

公开(公告)日：1979-01-12

申请号：FR7814656

申请日：1978-05-09

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

公开(公告)号：FR2378108A1

公开(公告)日：1978-08-18

申请号：FR7712638

申请日：1977-04-19

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

公开(公告)号：CA1214426A

公开(公告)日：1986-11-25

申请号：CA415906

申请日：1982-11-18

Applicant: IBM

Inventor： BARCLAY DONALD J ,  VIGAR JAMES M ,  MORGAN WILLIAM M

IPC: C25D3/06

Abstract: TRIVALENT CHROMIUM ELECTROPLATING SOLUTION AND BATH A chromium electroplating solution in which the source of chromium is an aqueous solution of chromium (III) complexes. The complexes are selected from a solution of chromium (III) and at least one of aspartic acid or an organic compound having a -C=S group or a -C-S- group. A supporting electrolyte is chloride free and comprises a mixture of sodium and potassium sulphates in a concentration sufficient to provide electrical conductivity for the plating process. The concentration of sodium sulphate is in the range of about 0.1 to 1 Molar and the concentration of potassium sulphate is about 1 Molar.

公开(公告)号：CA1123370A

公开(公告)日：1982-05-11

申请号：CA292140

申请日：1977-12-01

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/56

Abstract: Method and Composition for Electroplating Chromium and its Alloys and the Method of Manufacture of the Composition A plating solution, the making thereof and the use for chromium plating is disclosed. The solution is an equilibrated essentially aqueous solution of a hexavalent thiocyanatochromium III complex wherein the ratio of the total chromium III to the total thiocyanate is about 1:6. A preferred and improved method of making the solution from a hexathiocyanatochromium salt is also disclosed.

公开(公告)号：CS207586B2

公开(公告)日：1981-08-31

申请号：CS51578

申请日：1978-01-25

Applicant: IBM

Inventor： BARCLAY DONALD J ,  MORGAN WILLIAM M

IPC: C25D3/06 ,  C25D3/04

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.