公开(公告)号：DE69300234T2

公开(公告)日：1996-02-29

申请号：DE69300234

申请日：1993-03-03

Applicant: IBM

Inventor： BANKS PETER MICHAEL ,  MORGAN WILLIAM M

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

公开(公告)号：GB2265325A

公开(公告)日：1993-09-29

申请号：GB9205832

申请日：1992-03-18

Applicant: IBM

Inventor： BANKS PETER MICHAEL ,  MORGAN WILLIAM MORRIS

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

公开(公告)号：DE69300234D1

公开(公告)日：1995-08-10

申请号：DE69300234

申请日：1993-03-03

Applicant: IBM

Inventor： BANKS PETER MICHAEL ,  MORGAN WILLIAM M

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.