公开(公告)号：DE3273531D1

公开(公告)日：1986-11-06

申请号：DE3273531

申请日：1982-06-02

Applicant: IBM

Inventor： DOUGHERTY WILLIAM E ,  FEINBERG IRVING ,  HUMENIK JAMES N ,  PLATT ALAN

IPC: H01L27/04 ,  H01G2/06 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/10 ,  H01L27/108 ,  H01G1/14 ,  H01G1/035

Abstract: A decoupling thin film capacitor for mounting on an integrate circuit multi-layer ceramic. A bottom layer metallurgy (2) is evaporated or sputtered onto a carrier (1). A high dielectric layer (3) is deposited, followed by a top metallurgy (4) and an isolating layer (5). Via holes are etched to respective electrode layers, ball limiting metallurgy (6) deposited thereon followed by solder balls (7). The capacitor can be mounted onto a ceramic substrate face down in contact with a compatible footprint.

公开(公告)号：DE2212274A1

公开(公告)日：1972-09-21

申请号：DE2212274

申请日：1972-03-14

Applicant: IBM

Inventor： PLATT ALAN ,  TERNER EDWARD

IPC: H01L29/00 ,  H01L29/76 ,  H01L11/14