公开(公告)号：DE68920923D1

公开(公告)日：1995-03-16

申请号：DE68920923

申请日：1989-05-12

Applicant: IBM

Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

公开(公告)号：BR8903415A

公开(公告)日：1990-02-13

申请号：BR8903415

申请日：1989-07-12

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.