公开(公告)号：DE68920923T2

公开(公告)日：1995-08-10

申请号：DE68920923

申请日：1989-05-12

Applicant: IBM

Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

公开(公告)号：DE68920923D1

公开(公告)日：1995-03-16

申请号：DE68920923

申请日：1989-05-12

Applicant: IBM

Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.