公开(公告)号：GB2506534A

公开(公告)日：2014-04-02

申请号：GB201319413

申请日：2012-05-14

Applicant: IBM

Inventor： KUCZYNSKI JOSEPH ,  SINHA ARVIND KUMAR ,  SPLITTSTOESSER KEVIN ,  TOFIL TIMOTHY

IPC: H01L25/065 ,  H01L23/36

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.

公开(公告)号：GB2498464A

公开(公告)日：2013-07-17

申请号：GB201302341

申请日：2011-06-30

Applicant: IBM

Inventor： SINHA ARVIND KUMAR ,  KUCZYNSKI JOSEPH ,  TOFIL TIMOTHY ,  SPLITTSTOESSER KEVIN

IPC: C01B31/04 ,  H01L23/373

Abstract: A method for aligning graphite nanofibers in a thermal interface material includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.

公开(公告)号：DE112011101746T8

公开(公告)日：2013-06-06

申请号：DE112011101746

申请日：2011-06-30

Applicant: IBM

Inventor： SINHA ARVIND KUMAR ,  SPLITTSTOESSER KEVIN ,  TOFIL TIMOTHY ,  KUCZYNSKI JOSEPH

IPC: C01B31/02 ,  C01B31/04 ,  H01L23/373