公开(公告)号：DE69416204T2

公开(公告)日：1999-09-02

申请号：DE69416204

申请日：1994-05-06

Applicant: IBM

Inventor： BAUER TIBOR LOUIS ,  DART II CHARLES RICHARD ,  LINNELL DAVID CLYDE ,  CAVALIERE WILLIAM ALBERT ,  FREEBERN TIMOTHY HARRISON ,  MILLER JAMES M ,  WU JIN JWANG

IPC: B24C1/00 ,  B24C5/04 ,  H01L21/00

公开(公告)号：DE69416204D1

公开(公告)日：1999-03-11

申请号：DE69416204

申请日：1994-05-06

Applicant: IBM

Inventor： BAUER TIBOR LOUIS ,  DART II CHARLES RICHARD ,  LINNELL DAVID CLYDE ,  CAVALIERE WILLIAM ALBERT ,  FREEBERN TIMOTHY HARRISON ,  MILLER JAMES M ,  WU JIN JWANG

IPC: B24C1/00 ,  B24C5/04 ,  H01L21/00

公开(公告)号：DE69112913T2

公开(公告)日：1996-02-08

申请号：DE69112913

申请日：1991-05-29

Applicant: AIR PROD & CHEM ,  IBM

Inventor： MCDERMOTT WAYNE THOMAS ,  OCKOVIC RICHARD CARL ,  WU JIN JWANG ,  COOPER DOUGLAS WINSLOW ,  SCHWARZ ALEXANDER ,  WOLFE HENRY LEWIS

IPC: H01L21/304 ,  B08B3/12 ,  B08B7/00 ,  B24C1/00 ,  B24C3/32 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461 ,  B08B5/02

Abstract: A method is disclosed for cleaning microelectronic surfaces using an aerosol of at least substantially solid argon particles which impinge upon the surface to be cleaned and then evaporate and the resulting gas is removed by venting along with the contaminants dislodged by the cleaning method.

公开(公告)号：DE69415414T2

公开(公告)日：1999-07-15

申请号：DE69415414

申请日：1994-05-06

Applicant: IBM

Inventor： BAUER TIBOR LOUIS ,  CAVALIERE WILLIAM ALBERT ,  WU JIN JWANG ,  LINNELL DAVID CLYDE

IPC: B24C1/00 ,  B24C5/04 ,  H01L21/00

公开(公告)号：DE69415414D1

公开(公告)日：1999-02-04

申请号：DE69415414

申请日：1994-05-06

Applicant: IBM

Inventor： BAUER TIBOR LOUIS ,  CAVALIERE WILLIAM ALBERT ,  WU JIN JWANG ,  LINNELL DAVID CLYDE

IPC: B24C1/00 ,  B24C5/04 ,  H01L21/00

公开(公告)号：SG38864A1

公开(公告)日：1997-04-17

申请号：SG1995001122

申请日：1993-04-08

Applicant: AIR PROD & CHEM ,  IBM

Inventor： MCDERMOTT WAYNE THOMAS ,  WU JIN JWANG ,  OCKOVIC RICHARD CARL

IPC: B08B7/00 ,  B24C3/12 ,  B24C3/32 ,  B24C9/00 ,  H01L21/00 ,  B08B5/02 ,  B24C5/08 ,  H01L21/304

Abstract: The present invention is an apparatus for cleaning semi-conductor solid surfaces using a spray of frozen cryogen, such as argon, to impinge on the solid surface to remove contaminant particles. The apparatus includes an appropriate nozzle positioned in a housing designed for ultra clean conditions including sweep gas supply and evacuation conduits and a support table movably positioned within the housing to controllably convey the semi-conductor solid surface on a track under the spray of frozen cryogen emanating from the nozzle.