Abstract:
There is provided herein a curable epoxy composition comprising (a) at least one epoxy compound; (b) at least one oligomeric aromatic polyester phosphorus- containing curing agent; and, (c) at least one co-curing agent having a dielectric constant less than 4.0, or at least one co-curing agent which results in the cured epoxy composition having a dielectric constant of less than 4.0 and wherein the co-curing agent is other than the curing agent (b); and, an article comprising the curing agent, and a process of making a laminate.
Abstract:
There is provided herein an aluminum methyl methylphosphonate in crystalline form wherein 90% of the aluminum methyl methylphoshponate has a particle size of less than 10 microns, and wherein the aluminum methyl methylphosphonate is obtained by the process of reacting aluminum hydroxide with dimethyl methylphosphonate in the presence of a catalyst.
Abstract:
There is provided herein a styrenic polymer composition comprising a styrenic polymer and a flame retardant effective amount of a mixture comprising (a) at least one brominated flame retardant; and, (b) at least one solid phosphate ester that has a melting temperature of at least 80 degrees Celsius.
Abstract:
There is provided herein a styrenic polymer composition comprising a styrenic polymer and a flame retardant effective amount of a mixture comprising (a) at least one brominated flame retardant; and, (b) at least one solid phosphate ester that has a melting temperature of at least 80 degrees Celsius.
Abstract:
There is provided herein a flame retardant and curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.