公开(公告)号：DE10060436A1

公开(公告)日：2002-03-28

申请号：DE10060436

申请日：2000-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIDENHOEFER JUERGEN ,  POECHMUELLER PETER ,  KUHN JUSTUS ,  MUELLER JOCHEN ,  HUEBNER MICHAEL ,  KRAUSE GUNNAR

IPC: G01R31/319 ,  G11C29/48 ,  G11C29/56 ,  G01R31/3181 ,  G01R31/3177 ,  G11C29/00 ,  H01L21/66

Abstract: The device has connections for low frequency or LF signal communications with test equipment, especially for acquiring LF test signals such as data, control, address and clock signals, an arrangement for producing high frequency or HF test signals based on incoming LF test signals and second connections for HF signal communications with a circuit under test, especially for outputting HF test signals and receiving response signals from the circuit. The device has first connections (32a,32b) for low frequency signal communications with a test equipment (40), especially for acquiring low frequency test signals such as data, control, address and clock signals, an arrangement (38) for producing high frequency test signals based on incoming low frequency test signals and second connections (34a-34d) for high frequency signal communications with a circuit under test (52), especially for outputting high frequency test signals and receiving response signals from the circuit.

公开(公告)号：DE10334548A1

公开(公告)日：2005-03-03

申请号：DE10334548

申请日：2003-07-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL

IPC: G01R1/073 ,  G01R31/28 ,  H01R11/18

Abstract: A contact-making apparatus for making contact with circuit units to be tested in a tester contains a printed circuit board device that has electrical connections to the tester, and a test module device. The test module device has first contact-making elements for making electrical contact between the test module device and the printed circuit board device, and second contact-making elements for making electrical contact between the test module device and the circuit unit to be tested. When the printed circuit board device and the circuit unit to be tested are pressed onto each other, a spring force of the first contact-making elements is lower than the spring force of the second contact-making elements under a low initial compression, and a spring force of the first contact-making elements are higher than the spring force of the second contact-making elements under a high final compression.

公开(公告)号：DE10130977A1

公开(公告)日：2003-01-16

申请号：DE10130977

申请日：2001-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: A needle card (31,32) for testing integrated circuits on a substrate has sets of needles (4) so arranged to correspond with contacts on a curved edge of the substrate disk. Essentially all the needles are in contact with the corresponding integrated circuits. An Independent claim is also included for a test system using the needle card above.

公开(公告)号：DE10060438A1

公开(公告)日：2002-06-13

申请号：DE10060438

申请日：2000-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIDENHOEFER JUERGEN ,  POECHMUELLER PETER ,  KUHN JUSTUS ,  MUELLER JOCHEN ,  HUEBNER MICHAEL ,  KRAUSE GUNNAR

IPC: G01R31/3185 ,  G01R31/319 ,  G11C29/00 ,  G11C29/48 ,  G01R31/28 ,  G01R31/3181 ,  H01L21/66

Abstract: The testing device has a carrier plate (124) receiving electrical signal lines of a test system and contact needles (150) for providing electrical connections with contact surfaces of the tested IC's (160a,160b). The carrier plate has active bus modules (120,121) for each tested IC, inserted in the signal path between the electrical signal lines of the test system and the tested IC.