公开(公告)号：DE10116823C2

公开(公告)日：2003-10-30

申请号：DE10116823

申请日：2001-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL ,  VASQUEZ BARBARA ,  OSTENDORF HANS-CHRISTOPH

IPC: G01R35/00 ,  G01R31/28 ,  H01L21/66 ,  H01R11/00

公开(公告)号：DE10146176A1

公开(公告)日：2003-04-10

申请号：DE10146176

申请日：2001-09-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL

IPC: H01L23/58 ,  H01L21/60 ,  H01L21/66 ,  H01L23/50

公开(公告)号：DE10039928A1

公开(公告)日：2002-03-21

申请号：DE10039928

申请日：2000-08-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL ,  APPEN STEPHAN VON ,  KUND MICHAEL

IPC: G01R31/28 ,  G01R31/26 ,  H01L21/66

公开(公告)号：DE10039928B4

公开(公告)日：2004-07-15

申请号：DE10039928

申请日：2000-08-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL ,  APPEN STEPHAN VON ,  KUND MICHAEL

IPC: G01R31/28 ,  G01R31/26 ,  H01L21/66 ,  H01R11/18

公开(公告)号：DE10158567A1

公开(公告)日：2003-02-20

申请号：DE10158567

申请日：2001-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL

IPC: G01R1/04 ,  G01R1/44 ,  G01R31/28 ,  G01R31/26 ,  H01L21/66

Abstract: The needle card has a bearer board with a set of test tips (223) for application to predetermined contact points on the semiconducting wafer to contact components of the integrated circuit on the wafer and a heater (44) in thermal contact with the bearer board to set the needle card to a predetermined temperature. The heater is mounted on the underside of the bearer board near the test tips. AN Independent claim is also included for a test system with an inventive device.

公开(公告)号：DE10116823A1

公开(公告)日：2002-11-07

申请号：DE10116823

申请日：2001-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL ,  VASQUEZ BARBARA ,  OSTENDORF HANS-CHRISTOPH

IPC: G01R35/00 ,  G01R31/28 ,  H01L21/66

Abstract: Device for calibrating test cards (100') with unsprung contact elements (50') that are used to test semiconductor wafers has: a probe arrangement (200') that has first (KSIG') and second (KSCH') signal contact surfaces; and a positioning device for positioning the probe device on the test card so that first and second signal contact surfaces connect to first and second test card contact elements (50'); whereby the first and second contact surfaces are attached in a sprung manner to the probe arrangement.

公开(公告)号：DE10114291C1

公开(公告)日：2002-09-05

申请号：DE10114291

申请日：2001-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEBER FRANK ,  FAERBER GERRIT ,  HUEBNER MICHAEL ,  MOECKEL JENS ,  FRITZ MARTIN

IPC: G01R1/067 ,  G01R31/04 ,  G01R31/28 ,  H01L21/66 ,  H01L21/60

Abstract: The testing method uses a contact card (40) for application of a test voltage to one of the supply voltage terminals of each of a number of IC chips (12) incorporated in a semiconductor wafer (10) and measurement of the voltage at a second supply voltage terminal of each IC chip, for comparison with the applied voltage, for acceptance or rejection of the IC chip.

公开(公告)号：DE102005015826A1

公开(公告)日：2006-10-19

申请号：DE102005015826

申请日：2005-04-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER MICHAEL

IPC: H01L21/66 ,  G01N21/95 ,  H01L21/60

Abstract: The method involves optically detecting a surface of contact pads before and after contacting of the pads through a contact unit to generate a reference image (R) and an image which is to be analyzed, respectively. Difference between the images is established to generate an output image. The output image is analyzed to detect contrasts and/or impressions (13) that leave a contact unit on the pads during contacting. An independent claim is also included for a system for optical inspection of contact surfaces and/or contact pads in a semiconductor component.

公开(公告)号：DE10060438B4

公开(公告)日：2004-09-09

申请号：DE10060438

申请日：2000-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIDENHOEFER JUERGEN ,  POECHMUELLER PETER ,  KUHN JUSTUS ,  MUELLER JOCHEN ,  HUEBNER MICHAEL ,  KRAUSE GUNNAR

IPC: G01R31/3185 ,  G01R31/319 ,  G11C29/00 ,  G11C29/48 ,  G01R31/28 ,  G01R31/3181 ,  H01L21/66

公开(公告)号：DE10060437A1

公开(公告)日：2002-06-13

申请号：DE10060437

申请日：2000-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIDENHOEFER JUERGEN ,  POECHMUELLER PETER ,  KUHN JUSTUS ,  MUELLER JOCHEN ,  HUEBNER MICHAEL ,  KRAUSE GUNNAR

IPC: G01R1/02 ,  G01R31/28 ,  G01R31/319 ,  G11C29/00 ,  G11C29/48 ,  G01R31/26 ,  G01R31/3181 ,  H01L21/66 ,  H01L23/24

Abstract: The needle card device has a circuit board (70) for connection to signal lines of a test system and contact elements (36) for providing electrical conections with contact surfaces of the tested IC's (52). A carrier board (60) is provided with active modules (30), associated respectively with the tested IC's and inserted in the signal paths between the test system and the tested IC, with a heat dissipation device for removal of waste heat from each active module.