公开(公告)号：DE102004043639A1

公开(公告)日：2005-06-09

申请号：DE102004043639

申请日：2004-09-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BENDER CARSTEN ,  NOCKE KERSTIN

IPC: B23K3/06 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

公开(公告)号：DE10335182A1

公开(公告)日：2005-03-10

申请号：DE10335182

申请日：2003-07-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/38 ,  H01L23/50

Abstract: The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.