公开(公告)号：DE102004029765A1

公开(公告)日：2006-03-16

申请号：DE102004029765

申请日：2004-06-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  KROEHNERT STEFFEN ,  BENDER CARSTEN

IPC: H01L23/04 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

公开(公告)号：DE102004029585A1

公开(公告)日：2006-01-19

申请号：DE102004029585

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN ,  KROEHNERT STEFFEN

IPC: H01L21/48 ,  H01L23/053 ,  H01L23/12

Abstract: Chip package comprises a reinforcing layer (2) fixed to a system carrier (1). The reinforcing layer has openings (3) for the chip, in which the openings are as large as the dimensions of the chips. Each chip is surrounded by a reinforced frame and is embedded in the cavity produced.

公开(公告)号：DE10327882A1

公开(公告)日：2005-01-27

申请号：DE10327882

申请日：2003-06-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN

IPC: H05K3/34 ,  H01L23/488

Abstract: Semiconductor modules with BGA or similar components contain chips secured on substrate by die-attach material. At least one ball side substrate is coated with solder stop lacquer and an opposite side carries solder balls on contact pads for linking to contact pads on PCBs. Substrate chip side is capped. In region of contact pads, structures of lacquer are so changed, as to provide such direction of voltages for considerable reduction of mechanical stress.

公开(公告)号：DE10335182B4

公开(公告)日：2007-03-01

申请号：DE10335182

申请日：2003-07-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/38

Abstract: The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.

公开(公告)号：DE102005002862A1

公开(公告)日：2006-07-27

申请号：DE102005002862

申请日：2005-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  KAHLISCH KNUT ,  UHLMANN RUEDIGER ,  BENDER CARSTEN

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/498

Abstract: The method involves mounting a semiconductor chip on a chip side of a substrate, and applying solder balls on a solder ball side of the substrate. A lower grouting form (16) is pressed for detection of lower housing part on the ball side. The substrate surface is designed as sealing area on the ball side such that the surface is provided with sealing units, with which the grouting form receives a sealing connection. An independent claim is also included for a substrate for manufacturing of a fine ball grid array component.

公开(公告)号：DE102004043639A1

公开(公告)日：2005-06-09

申请号：DE102004043639

申请日：2004-09-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BENDER CARSTEN ,  NOCKE KERSTIN

IPC: B23K3/06 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

公开(公告)号：DE10335182A1

公开(公告)日：2005-03-10

申请号：DE10335182

申请日：2003-07-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/38 ,  H01L23/50

Abstract: The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.

公开(公告)号：DE102004029584A1

公开(公告)日：2006-01-12

申请号：DE102004029584

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  BENDER CARSTEN

IPC: H01L21/44 ,  H01L23/04 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/28 ,  H05K3/34

Abstract: An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.

公开(公告)号：DE102005001590B4

公开(公告)日：2007-08-16

申请号：DE102005001590

申请日：2005-01-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  BENDER CARSTEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA MINKA ,  SAVIGNAC DOMINIQUE

IPC: H01L23/50 ,  H01L25/065

公开(公告)号：DE10347320A1

公开(公告)日：2005-05-19

申请号：DE10347320

申请日：2003-10-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BLASZCZAK STEPHAN ,  SCHEIBE BERND ,  BENDER CARSTEN ,  NOCKE KERSTIN

IPC: H01L23/00 ,  H01L23/13 ,  H01L23/12 ,  H01L23/50

Abstract: A tape (2) glues a chip (3) face down on a substrate (1) with a passage way, a bonding channel (4) and a structured metal coating (5) on an underside, which has grid-type contact pads (6) and bonding pads (7) near the edge of the bonding channel to interlink these electrically. An independent claim is also included for a structure for a chip package to be constructed on a substrate with a chip mounted face down on the substrate and with protection to its rear side and edges by means of a sealing compound firmly bonded to the substrate.