公开(公告)号：DE69836943D1

公开(公告)日：2007-03-15

申请号：DE69836943

申请日：1998-09-29

Applicant: IBM ,  INFINEON TECHNOLOGIES AG

Inventor： VARIAN KATHRYN H ,  TOBBEN DIRK ,  SENDELBACH MATTHEW

IPC: H01L21/302 ,  H01L21/3105 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/762 ,  H01L21/768 ,  H01L23/522

Abstract: A substantially planar surface is produced from a non-conformal device layer formed over a complex topography, which includes narrow features with narrow gaps and wide features and wide gaps. A conformal layer is deposited over the non-conformal layer. The surface is then polished to expose the non-conformal layer over the wide features. An etch selective to the non-conformal layer is then used to substantially remove the non-conformal layer over the wide features. The conformal layer is then removed, exposing the non-conformal layer. The thickness of the non-conformal layer is now more uniform as compared to before. This enables the polish to produce a planar surface with reduced dishing in the wide spaces.