公开(公告)号：WO2018128617A1

公开(公告)日：2018-07-12

申请号：PCT/US2017/012367

申请日：2017-01-05

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor

IPC: H01P5/08 ,  H01P3/16 ,  G06F15/16

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

公开(公告)号：WO2018128615A1

公开(公告)日：2018-07-12

申请号：PCT/US2017/012364

申请日：2017-01-05

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  SWAN, Johanna

IPC: H01P5/18 ,  H01P1/207 ,  H01P5/103

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 µm and 1,000 µm

公开(公告)号：WO2018063367A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054900

申请日：2016-09-30

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna ,  RAWLINGS, Brandon

Inventor： KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna ,  RAWLINGS, Brandon

IPC: H01P1/04 ,  H01P3/12 ,  H01P5/08

CPC classification number: H01P1/042 ,  H01P1/022 ,  H01P3/12 ,  H01P3/121 ,  H01P3/122 ,  H01P11/002

Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

Abstract translation: 通常，本公开提供了用于将波导耦合到具有模块化连接器系统的服务器封装的装置和系统，以及用于制造这种连接器系统的方法。 这种系统可以用连接波导形成，该连接波导转动所需量，这又可以允许服务器封装在任何给定方向上通过波导束发送信号而不弯曲波导。

公开(公告)号：EP3712939A1

公开(公告)日：2020-09-23

申请号：EP20156740.1

申请日：2020-02-11

Applicant: INTEL Corporation

Inventor： ELSHERBINI, Adel A. ,  DOGIAMIS, Georgios ,  LIFF, Shawna ,  SWAN, Johanna ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  ALEKSOV, Aleksandar

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/485

Abstract: Embodiments may relate to a microelectronic package that includes a radio frequency (RF) chip coupled with a die by interconnects with a first pitch. The RF chip may further be coupled with a waveguide of a package substrate by interconnects with a second pitch that is different than the first pitch. The RF chip may facilitate conveyance of data to the waveguide as an electromagnetic signal with a frequency greater than approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：EP4105982A1

公开(公告)日：2022-12-21

申请号：EP22169613.1

申请日：2022-04-25

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  STRONG, Veronica ,  DOGIAMIS, Georgios ,  PRABHU GAUNKAR, Neelam ,  ALEKSOV, Aleksandar

IPC: H01L23/15 ,  H01L23/498

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating coaxial structures within glass package substrates. These techniques, in embodiments, may be extended to create other structures, for example capacitors within glass substrates. Other embodiments may be described and/or claimed.

公开(公告)号：EP3712938A1

公开(公告)日：2020-09-23

申请号：EP20156735.1

申请日：2020-02-11

Applicant: INTEL Corporation

Inventor： BRAUNISCH, Henning ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  DOGIAMIS, Georgios ,  DISCHLER, Richard ,  SWAN, Johanna ,  PROKOFF, Victor

IPC: H01L23/66 ,  H01L25/065

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：EP4356426A1

公开(公告)日：2024-04-24

申请号：EP22825486.8

申请日：2022-03-25

Applicant: INTEL Corporation

Inventor： DOGIAMIS, Georgios ,  YU, Qiang ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M.

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/14 ,  H01L23/522

CPC classification number: H01L23/5383 ,  H01L23/49816 ,  H01L23/5385 ,  H01L25/50 ,  H01L25/0652 ,  H01L2225/0657220130101 ,  H01L2225/0658620130101 ,  H01L24/08 ,  H01L2224/0822520130101 ,  H01L2224/0823520130101 ,  H01L24/80

公开(公告)号：EP4109524A1

公开(公告)日：2022-12-28

申请号：EP22159631.5

申请日：2022-03-02

Applicant: INTEL Corporation

Inventor： DOGIAMIS, Georgios ,  Elsherbini, Adel ,  YU, Qiang ,  Liff, Shawna ,  CHOI, Beomseok

IPC: H01L25/065 ,  H01L23/00

Abstract: Apparatus and methods are disclosed. In one example, a semiconductor package includes a first die that has a first surface and a first electrical lead at or near the first surface. The semiconductor package also includes a substrate that has a second surface and is coupled to the first die at a first interface. The substrate also includes a first electrode at or near the second surface and at least a first portion of an integrated passive device that is coupled to the first electrode. The first electrode is aligned with and coupled to the first electrical lead across the first interface.

公开(公告)号：EP3794673A1

公开(公告)日：2021-03-24

申请号：EP19804037.0

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： DOGIAMIS, Georgios ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  SWAN, Johanna M.

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00

公开(公告)号：EP4213186A1

公开(公告)日：2023-07-19

申请号：EP22206306.7

申请日：2022-11-09

Applicant: INTEL Corporation

Inventor： STRONG, Veronica ,  KAMGAING, Telesphor ,  ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios ,  RAWLINGS, Brandon ,  PRABHU GAUNKAR, Neelam

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538

Abstract: Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.