公开(公告)号：WO2018057006A1

公开(公告)日：2018-03-29

申请号：PCT/US2016/053491

申请日：2016-09-23

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  SWAN, Johanna ,  LIFF, Shawna ,  ELSHERBINI, Adel ,  KAMGAING, Telesphor ,  ALEKSOV, Aleksandar

IPC: H01P5/107 ,  H01P3/00 ,  H01L23/66

CPC classification number: H01Q13/02 ,  H01L23/66 ,  H01P3/121 ,  H01P5/107 ,  H01Q21/064

Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

Abstract translation: 侧辐射波导发射器系统集成到半导体封装中有利地允许波导直接耦合到半导体封装。 包括由电介质材料分开的第一导电构件和第二导电构件。 还包括导电结构，诸如多个通孔，其导电地耦合第一导电构件和第二导电构件。 第一导电构件，第二导电构件和导电结构一起形成封闭电介质材料内的成形空间的导电侧向辐射波导发射器。 成形空间包括窄的第一端和宽的第二端。 RF激励元件设置在第一端附近，并且波导可以可操作地耦合到成形空间的第二端附近。

公开(公告)号：WO2022265709A1

公开(公告)日：2022-12-22

申请号：PCT/US2022/021882

申请日：2022-03-25

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  YU, Qiang ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M.

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/14 ,  H01L23/522

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die-level interposer having a first surface and an opposing second surface; a first die coupled to the first surface of the die-level interposer by a first hybrid bonding region having a first pitch; a second die coupled to the second surface of the die-level interposer by a second hybrid bonding region having a second pitch different from the first pitch; and a third die coupled to the second surface of the die-level interposer by a third hybrid bonding region having a third pitch different from the first and second pitches.

公开(公告)号：WO2019009875A1

公开(公告)日：2019-01-10

申请号：PCT/US2017/040554

申请日：2017-07-01

Applicant: INTEL CORPORATION ,  DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor ,  EWY, Erich ,  ELSHERBINI, Adel ,  SWAN, Johanna

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor ,  EWY, Erich ,  ELSHERBINI, Adel ,  SWAN, Johanna

IPC: H01P3/16 ,  H01P5/08 ,  H01Q1/50

Abstract: Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

公开(公告)号：WO2018125227A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069540

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/107

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

公开(公告)号：WO2018063238A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054417

申请日：2016-09-29

Applicant: INTEL CORPORATION ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna

Inventor： OSTER, Sasha ,  DOGIAMIS, Georgios ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna

IPC: H01L25/16 ,  H01L25/065 ,  H01L25/10 ,  H01L23/66 ,  H01L23/00

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/117 ,  H01L25/16 ,  H01L25/165 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/10545

Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.

Abstract translation: 毫米波（毫米波）通信接口包括耦合到第一衬底的第一半导体封装和耦合到第二衬底的第二半导体封装。 第二衬底可以以大约90°的角度耦合。 与第一衬底成角度。 第二半导体封装可以包括在高频微波信号上调制数字数据的毫米波管芯和将调制的高频微波信号发射到可操作地耦合到第二基板的波导部件中的毫米波发射器。 在这样的实施方式中，波导构件可以沿着平行于第一基板的主平面的纵向轴线有利地离开第二基板。 有利的是，所有的高频部件都紧密耦合到第二衬底而不使用介入界面。

公开(公告)号：WO2021040955A1

公开(公告)日：2021-03-04

申请号：PCT/US2020/044128

申请日：2020-07-30

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios ,  EID, Feras ,  ALEKSOV, Aleksandar ,  SWAN, Johanna M.

IPC: H01L23/66 ,  H01L23/50 ,  H01L23/367 ,  H03H9/25 ,  H01L23/522

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.

公开(公告)号：WO2019009874A1

公开(公告)日：2019-01-10

申请号：PCT/US2017/040553

申请日：2017-07-01

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor ,  EWY, Erich ,  SHOEMAKER, Kenneth ,  ELSHERBINI, Adel ,  SWAN, Johanna

IPC: H05K5/00 ,  H01L23/58 ,  B60R16/02

Abstract: Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

公开(公告)号：WO2018125228A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069543

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor

IPC: H01P3/16 ,  H01P3/12 ,  H01P3/08

Abstract: Embodiments of the invention may include a mm-wave waveguide. In an embodiment, the mm-wave waveguide may include a first dielectric waveguide and a second dielectric waveguide. A conductive layer may be used to cover the first dielectric waveguide and the second dielectric waveguide in some embodiments. Furthermore, embodiments may include a repeater communicatively coupled between the first dielectric waveguide and the second dielectric waveguide. In an embodiment, the repeater may be an active repeater or a passive repeater. According to an embodiment, a passive repeater may be integrated within the dielectric waveguide. The passive repeater may include a dispersion compensating material that produces a dispersion response in a signal that is substantially opposite to a dispersion response produced when the signal is propagated along the dielectric waveguide.

公开(公告)号：WO2022265700A1

公开(公告)日：2022-12-22

申请号：PCT/US2022/019495

申请日：2022-03-09

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  YU, Qiang ,  EID, Feras ,  ELSHERBINI, Adel ,  JUN, Kimin ,  SWAN, Johanna ,  LIFF, Shawna

IPC: H01L23/00 ,  H01L23/367

Abstract: An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side of the interposer, where the first side of the interposer includes first bond pads coupled to first bond pads of the first IC chip, and the second side of the interposer includes second bond pads coupled to first bond pads of the second IC chip. In an embodiment of the present description, a liquid cooled three-dimensional IC (3DIC) package may be formed with the IC package, where at least two IC devices may be stacked with a liquid cooled interposer. In a further embodiment, the liquid cooled 3DIC package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

公开(公告)号：WO2019221885A1

公开(公告)日：2019-11-21

申请号：PCT/US2019/029032

申请日：2019-04-25

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  SWAN, Johanna M.

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00

Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.