公开(公告)号：US10955877B2

公开(公告)日：2021-03-23

申请号：US16216240

申请日：2018-12-11

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display and a second display coupled to the first display via a first hinge. The example computing device also includes a keyboard coupled to the second display via a second hinge.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US11455016B2

公开(公告)日：2022-09-27

申请号：US17173485

申请日：2021-02-11

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.

公开(公告)号：US20220225530A1

公开(公告)日：2022-07-14

申请号：US17699513

申请日：2022-03-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tongyan Zhai ,  Lance Lin ,  Min Suet Lim ,  Twan Sing Loo

IPC: H05K7/20 ,  H05K1/02 ,  G06F1/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a first side and an opposite second side. A first air mover can be coupled to the first side of the support structure, where a motor of the first air mover is on the support structure and an air mover controller where the air mover controller controls the first air mover through trace in the support structure. In some examples, a second air mover can be located on the second side of the support structure, where a motor of the second air mover is on the second side of the support structure and the second air mover is controlled by the air mover controller through trace in the support structure. The support structure can be a printed circuit board or motherboard.

公开(公告)号：US20190121399A1

公开(公告)日：2019-04-25

申请号：US16216240

申请日：2018-12-11

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display and a second display coupled to the first display via a first hinge. The example computing device also includes a keyboard coupled to the second display via a second hinge.

公开(公告)号：US20250008680A1

公开(公告)日：2025-01-02

申请号：US18344638

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Min Suet Lim ,  Lance Lin ,  Arnab Sen ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Thermal management systems for electronic devices and related methods are disclosed. An example electronic device includes a chassis including a first cover and a second cover, the first cover including an upper surface and a plurality of side walls and the second cover including a lower surface of the chassis, the first cover and the second cover defining an internal cavity of the chassis, the first cover including a first device inlet formed in a first side wall of the first cover; a fan positioned in the internal cavity, the fan including a first fan inlet and a second fan inlet opposite the first fan inlet; and a side channel positioned between the first device inlet and the first fan inlet to direct fluid flow between the first device inlet and the first fan inlet.

公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：US20170179645A1

公开(公告)日：2017-06-22

申请号：US14976170

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Gavin Sung ,  Jeff Ku ,  Lance Lin ,  Tim Liu ,  Jason Y. Jiang

IPC: H01R13/64 ,  H01R13/24

CPC classification number: H01R13/64 ,  G06F1/1613 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/631 ,  H01R2201/06

Abstract: In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.