公开(公告)号：US20200294884A1

公开(公告)日：2020-09-17

申请号：US16355596

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Je-Young Chang ,  Kelly Lofgreen ,  Weihua Tang ,  Aastha Uppal

IPC: H01L23/38 ,  H01L35/10 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

公开(公告)号：US20220104399A1

公开(公告)日：2022-03-31

申请号：US17540910

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Prakash Kurma Raju ,  Kathiravan Dhandapani

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/36

Abstract: In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

公开(公告)号：US20250008685A1

公开(公告)日：2025-01-02

申请号：US18216049

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Nirmala Bailur ,  Min Suet Lim ,  Tongyan Zhai ,  Chee Chun Yee ,  Ruander Cardenas ,  Lance Lin ,  Eng Huat Goh ,  Javed Shaikh ,  Jun Liao ,  Kavitha Nagarajan ,  Tin Poay Chuah ,  Martin M. Chang ,  Shantanu D. Kulkarni ,  Telesphor Kamgaing

IPC: H05K7/20 ,  F04D19/00 ,  F04D29/52 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.

公开(公告)号：US11676883B2

公开(公告)日：2023-06-13

申请号：US16355596

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Je-Young Chang ,  Kelly Lofgreen ,  Weihua Tang ,  Aastha Uppal

IPC: H01L23/38 ,  H01L35/10 ,  H01L35/30 ,  H01L35/18 ,  H01L35/16

CPC classification number: H01L23/38 ,  H01L35/10 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20220300048A1

公开(公告)日：2022-09-22

申请号：US17712010

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Jeff Ku ,  Fern Nee Tan ,  John Lang ,  Kavitha Nagarajan ,  Javed Shaikh ,  Deepak Sekar

IPC: G06F1/20 ,  G06F1/16 ,  H01L23/373 ,  H05K1/02 ,  H05K7/20

Abstract: Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

公开(公告)号：US20230209775A1

公开(公告)日：2023-06-29

申请号：US17561916

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Kathiravan Dhandapani ,  Greeshmaja Govind ,  Asif S. Khan ,  Bijendra Singh ,  Yagnesh V. Waghela

IPC: H05K7/20 ,  F28D15/04 ,  F28D15/06 ,  F28D15/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28D15/06 ,  F28D15/046 ,  F28D15/0208 ,  F28D15/0233 ,  G06F1/20 ,  H05K7/20381 ,  G06F2200/201

Abstract: Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

公开(公告)号：US20210022266A1

公开(公告)日：2021-01-21

申请号：US17033518

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Prakash Kurma Raju ,  Kathiravan Dhandapani

IPC: H05K7/20 ,  H01L23/36 ,  G06F1/20

Abstract: In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

公开(公告)号：US20200219789A1

公开(公告)日：2020-07-09

申请号：US16241108

申请日：2019-01-07

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Je-Young Chang ,  Javed Shaikh ,  Divya Mani ,  Weihua Tang

IPC: H01L23/427 ,  H01L23/522 ,  H01L21/48 ,  H01L23/00

Abstract: An integrated circuit structure may be formed using a phase change material to substantially fill at least one chamber within the integrated circuit assembly to increase thermal capacitance. The integrated circuit assembly may comprise a substrate, at least one integrated circuit device electrically attached to the substrate, a heat dissipation device, a thermal interface material between the integrated circuit device and the heat dissipation device, a chamber defined by the heat dissipation device, the substrate, and the integrated circuit device, and a phase change material within the chamber.