VACUUM-BASED ATTACHMENT FOR HEAT SINK AND RADIATION SHIELD

    公开(公告)号:US20230097977A1

    公开(公告)日:2023-03-30

    申请号:US18074701

    申请日:2022-12-05

    Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

    LOW-PROFILE FASTENERS WITH SPRINGS FOR HEAT TRANSFER DEVICE LOADING

    公开(公告)号:US20230093095A1

    公开(公告)日:2023-03-23

    申请号:US18059534

    申请日:2022-11-29

    Abstract: Low-profile fasteners with springs that are either integrated with the fastener or are a physically separate component can provide a more evenly distributed load to a heat transfer device, such as a vapor chamber or a heat pipe. The low-profile fasteners do not increase the height of the base of a mobile computing device as the spring and the portion of the fastener that extends past the spring fit within a recess or cavity of the heat transfer device. The spring can be a diaphragm spring, a wave spring, or another suitable spring. The use of low-profile fasteners with springs to fasten a heat transfer device to a mainboard may allow for designs with a smaller mainboard area, which can leave room for a larger thermal management solution (which can increase cooling capacity) and allow for a greater thermal design power for the system.

    MODULAR VAPOR CHAMBER AND CONNECTION OF SEGMENTS OF MODULAR VAPOR CHAMBER

    公开(公告)号:US20230020484A1

    公开(公告)日:2023-01-19

    申请号:US17955205

    申请日:2022-09-28

    Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

    Hybrid keyboard
    7.
    发明授权

    公开(公告)号:US10963015B2

    公开(公告)日:2021-03-30

    申请号:US16728632

    申请日:2019-12-27

    Abstract: Particular embodiments described herein provide for an electronic device that includes a hybrid keyboard. The keyboard can include a first portion of keys with a first key travel and a second portion of keys with a second key travel. The second key travel is less than the first key travel and a support plate can be raised under the second portion of keys and cause the second portion of keys to have the second key travel. In an example, a heat pipe or some other component can be located under the raised support plate and second portion of keys with the second key travel.

    HEAT EXCHANGE APPARATUS AND METHODS FOR HYPERBARIC COOLING FAN APPLICATIONS

    公开(公告)号:US20240431066A1

    公开(公告)日:2024-12-26

    申请号:US18340577

    申请日:2023-06-23

    Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

    THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS

    公开(公告)号:US20250008680A1

    公开(公告)日:2025-01-02

    申请号:US18344638

    申请日:2023-06-29

    Abstract: Thermal management systems for electronic devices and related methods are disclosed. An example electronic device includes a chassis including a first cover and a second cover, the first cover including an upper surface and a plurality of side walls and the second cover including a lower surface of the chassis, the first cover and the second cover defining an internal cavity of the chassis, the first cover including a first device inlet formed in a first side wall of the first cover; a fan positioned in the internal cavity, the fan including a first fan inlet and a second fan inlet opposite the first fan inlet; and a side channel positioned between the first device inlet and the first fan inlet to direct fluid flow between the first device inlet and the first fan inlet.

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