公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20240410396A1

公开(公告)日：2024-12-12

申请号：US18329763

申请日：2023-06-06

Applicant: Intel Corporation

Inventor： Arnab Sen ,  Srinivasarao Konakalla ,  Samarth Alva ,  Amit Kumar ,  Rachit Garg ,  Bhavaneeswaran Anbalagan ,  Raghavendra S. Kanivihalli ,  Prasanna Pichumani

IPC: F04D29/66 ,  F04D17/16 ,  F04D25/08 ,  F04D29/28 ,  G06F1/20

Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.

公开(公告)号：US20230097977A1

公开(公告)日：2023-03-30

申请号：US18074701

申请日：2022-12-05

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Juha Tapani Paavola ,  Arnab Sen

IPC: H05K9/00 ,  H05K1/02

Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

公开(公告)号：US20230093095A1

公开(公告)日：2023-03-23

申请号：US18059534

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Nagaraj K ,  Deepak Sekar ,  Arnab Sen

IPC: F16B23/00 ,  H05K1/02

Abstract: Low-profile fasteners with springs that are either integrated with the fastener or are a physically separate component can provide a more evenly distributed load to a heat transfer device, such as a vapor chamber or a heat pipe. The low-profile fasteners do not increase the height of the base of a mobile computing device as the spring and the portion of the fastener that extends past the spring fit within a recess or cavity of the heat transfer device. The spring can be a diaphragm spring, a wave spring, or another suitable spring. The use of low-profile fasteners with springs to fasten a heat transfer device to a mainboard may allow for designs with a smaller mainboard area, which can leave room for a larger thermal management solution (which can increase cooling capacity) and allow for a greater thermal design power for the system.

公开(公告)号：US20240155790A1

公开(公告)日：2024-05-09

申请号：US18544694

申请日：2023-12-19

Applicant: Intel Corporation

Inventor： Deepak Sekar ,  Samarth Alva ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Arnab Sen

IPC: H05K5/02 ,  F16B2/20 ,  H05K9/00

CPC classification number: H05K5/0221 ,  F16B2/20 ,  H05K9/0024 ,  H05K9/0049

Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.

公开(公告)号：US20230020484A1

公开(公告)日：2023-01-19

申请号：US17955205

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Feroze Khan ,  Arnab Sen ,  Jeff Ku ,  Samarth Alva

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

公开(公告)号：US10963015B2

公开(公告)日：2021-03-30

申请号：US16728632

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Arnab Sen ,  Bijendra Singh

IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20 ,  H01H9/52 ,  H01H13/88 ,  H01H13/70

Abstract: Particular embodiments described herein provide for an electronic device that includes a hybrid keyboard. The keyboard can include a first portion of keys with a first key travel and a second portion of keys with a second key travel. The second key travel is less than the first key travel and a support plate can be raised under the second portion of keys and cause the second portion of keys to have the second key travel. In an example, a heat pipe or some other component can be located under the raised support plate and second portion of keys with the second key travel.

公开(公告)号：US20240431066A1

公开(公告)日：2024-12-26

申请号：US18340577

申请日：2023-06-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Chi Chou Cheng ,  Jeffrey Ho ,  Chih-Tsung Hu ,  Srinivasarao Konakalla ,  Tsung-Kai Lin ,  Arnab Sen ,  Chiu-Chun Wang ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

公开(公告)号：US20250008680A1

公开(公告)日：2025-01-02

申请号：US18344638

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Min Suet Lim ,  Lance Lin ,  Arnab Sen ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Thermal management systems for electronic devices and related methods are disclosed. An example electronic device includes a chassis including a first cover and a second cover, the first cover including an upper surface and a plurality of side walls and the second cover including a lower surface of the chassis, the first cover and the second cover defining an internal cavity of the chassis, the first cover including a first device inlet formed in a first side wall of the first cover; a fan positioned in the internal cavity, the fan including a first fan inlet and a second fan inlet opposite the first fan inlet; and a side channel positioned between the first device inlet and the first fan inlet to direct fluid flow between the first device inlet and the first fan inlet.

公开(公告)号：US20240098938A1

公开(公告)日：2024-03-21

申请号：US18526948

申请日：2023-12-01

Applicant: Intel Corporation

Inventor： Ravishankar Srikanth ,  Vijith Halestoph R ,  Prakash Kurma Raju ,  Arnab Sen ,  Isha Garg ,  Ezekiel Poulose ,  Avinash Manu Aravindan

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20154 ,  H05K7/2039

Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.