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公开(公告)号：US20200245483A1
公开(公告)日：2020-07-30
申请号：US16847106
申请日：2020-04-13
Applicant: Intel Corporation
Inventor： Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah , Prakash Pillai , Sagar Pawar , Aneesh Tuljapurkar , Raghavendra N.
Abstract: Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.
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公开(公告)号：US10580267B2
公开(公告)日：2020-03-03
申请号：US16024633
申请日：2018-06-29
Applicant: Intel Corporation
Inventor： Sanjay Aghara , Samarth Alva , Arvind S , Sean J. Lawrence , Raghavendra Angadimani , Satyajit Siddharay Kamat
Abstract: Components, devices, systems, and methods for providing a movable haptic actuator for a user interacting with a simulated environment. The simulated environment may be virtual reality, augmented reality, or mixed reality. A fastener may be used to couple the haptic actuator to a wearable article worn by the user. The haptic actuator communicates with a controller to receive information to provide feedback to the user during operations of the simulated environment. The haptic actuator may be movable from a first position on the wearable article to a second position.
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公开(公告)号：US20240155790A1
公开(公告)日：2024-05-09
申请号：US18544694
申请日：2023-12-19
Applicant: Intel Corporation
Inventor： Deepak Sekar , Samarth Alva , Prakash Kurma Raju , Prasanna Pichumani , Arnab Sen
CPC classification number: H05K5/0221 , F16B2/20 , H05K9/0024 , H05K9/0049
Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.
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公开(公告)号：US20240019914A1
公开(公告)日：2024-01-18
申请号：US18477881
申请日：2023-09-29
Applicant: Intel Corporation
Inventor： Krishnendu Saha , Pawan Shiv Vadakattu , Samarth Alva , Bala Subramanya
IPC: G06F1/20 , H05K7/20 , H02M7/5387
CPC classification number: G06F1/20 , H05K7/20172 , H02M7/5387
Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.
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公开(公告)号：US20230269867A1
公开(公告)日：2023-08-24
申请号：US17842215
申请日：2022-06-16
Applicant: Intel Corporation
Inventor： Smit Kapila , Navneet Singh , Samantha Rao , Samarth Alva
CPC classification number: H05K1/0271 , H05K1/181 , H05K2201/10015
Abstract: Capacitors are commonly used in design and manufacturing of PCBs, which may exhibit a vibration effect, such as a piezoelectric effect. This vibration may induce acoustic noise. PCB capacitor-induced acoustic noise mitigation may include receiving an AC input that is converted and applied to a voltage rail, which may be used by first capacitor set. An additional capacitor set may receive and invert the voltage rail signal and oscillate (e.g., vibrate) out of phase with the first capacitor set, such that the second capacitor set mitigates or cancels the acoustic noise generated by the first capacitor set.
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Patent Agency Ranking
公开(公告)号：US20230020484A1
公开(公告)日：2023-01-19
申请号：US17955205
申请日：2022-09-28
Applicant: Intel Corporation
Inventor： Feroze Khan , Arnab Sen , Jeff Ku , Samarth Alva
IPC: H05K7/20
Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.
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公开(公告)号：US11432421B2
公开(公告)日：2022-08-30
申请号：US16847106
申请日：2020-04-13
Applicant: Intel Corporation
Inventor： Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah , Prakash Pillai , Sagar Pawar , Aneesh Tuljapurkar , Raghavendra N
Abstract: Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.
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公开(公告)号：US11119542B2
公开(公告)日：2021-09-14
申请号：US16367684
申请日：2019-03-28
Applicant: Intel Corporation
Inventor： Arvind Sundaram , Samarth Alva , Yogesh Channaiah
Abstract: Particular embodiments described herein provide for an electronic device that includes a first housing, a second housing, and a hinge. The hinge rotatably couples the first housing to the second housing and includes an off-center lobe that generates a field. The second housing includes a detection engine to detect a strength of the field generated by the off-center lobe and determines a hinge angle (or a position of the first housing relative to the second housing) based on the detected strength of the field generated by the off-center lobe.
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公开(公告)号：US10534407B2
公开(公告)日：2020-01-14
申请号：US16232140
申请日：2018-12-26
Applicant: Intel Corporation
Inventor： Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah
Abstract: Technologies for a hinge for a dual-screen clamshell computing device include a hinge having a drive shaft and a driven shaft. The drive shaft is fixed to a member such as a secondary display housing of the computing device. The driven shaft is rotatably coupled to another member such as a base housing of the computing device. The hinge includes a one-way needle bearing fixed to the same member as the driven shaft. The driven shaft passes through the one-way needle bearing, which allows free rotation of the driven shaft in one direction and prevents rotation of the driven shaft in the other direction. The hinge includes a coupling joint that selectively couples the drive shaft and the driven shaft. The computing device includes a trigger that is operable to selectively engage and disengage the coupling joint of the hinge. Other embodiments are described and claimed.
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公开(公告)号：US20240347965A1
公开(公告)日：2024-10-17
申请号：US18740164
申请日：2024-06-11
Applicant: Intel Corporation
Inventor： Samarth Alva , Jagadish Singh , Prakash Kurma Raju , Arvind S , Jun Liu , Vinaya Kumar Chandrasekhara , Kasthuri Rangan Vijayasarathy , Anoop Parchuru , Smitha Kashyap Chandrachooda
CPC classification number: H01R13/6205 , H01R13/64
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for magnetic connectors with asymmetric attach/detach mechanism. An example electronic device disclose herein includes a port having an opening to receive a connector and a magnet array associated with the port. The magnet array includes a first magnet, and a second magnet. The electronic device includes a spring to bias at least one of the first magnet or second magnet away from the opening.
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