公开(公告)号：US12210477B2

公开(公告)日：2025-01-28

申请号：US17428530

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Altug Koker ,  Joydeep Ray ,  Ben Ashbaugh ,  Jonathan Pearce ,  Abhishek Appu ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma ,  Elmoustapha Ould-Ahmed-Vall ,  Aravindh Anantaraman ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Yoav Harel ,  Arthur Hunter, Jr. ,  Brent Insko ,  Scott Janus ,  Pattabhiraman K ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Marian Alin Petre ,  Murali Ramadoss ,  Shailesh Shah ,  Kamal Sinha ,  Prasoonkumar Surti ,  Vikranth Vemulapalli

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0888 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06T1/20 ,  G06T1/60 ,  H03M7/46 ,  G06N3/08 ,  G06T15/06

Abstract: Systems and methods for improving cache efficiency and utilization are disclosed. In one embodiment, a graphics processor includes processing resources to perform graphics operations and a cache controller of a cache coupled to the processing resources. The cache controller is configured to control cache priority by determining whether default settings or an instruction will control cache operations for the cache.

公开(公告)号：US12056789B2

公开(公告)日：2024-08-06

申请号：US18455128

申请日：2023-08-24

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

CPC classification number: G06T1/20 ,  G06F13/4027

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US11763416B2

公开(公告)日：2023-09-19

申请号：US17500375

申请日：2021-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

CPC classification number: G06T1/20 ,  G06F13/4027

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US11709714B2

公开(公告)日：2023-07-25

申请号：US17686089

申请日：2022-03-03

Applicant: Intel Corporation

Inventor： Ben Ashbaugh ,  Jonathan Pearce ,  Murali Ramadoss ,  Vikranth Vemulapalli ,  William B. Sadler ,  Sungye Kim ,  Marian Alin Petre

IPC: G06F9/50 ,  G06F9/38 ,  G06F9/54 ,  G06F12/0837 ,  G06F9/48 ,  G06F9/345 ,  G06T1/60 ,  G06F9/30 ,  G06T15/00 ,  G06F16/245 ,  G06T1/20

CPC classification number: G06F9/5027 ,  G06F9/3455 ,  G06F9/3851 ,  G06F9/3877 ,  G06F9/3885 ,  G06F9/4881 ,  G06F9/5033 ,  G06F9/5066 ,  G06F9/545 ,  G06F12/0837 ,  G06F9/30178 ,  G06F9/3887 ,  G06F16/24569 ,  G06T1/20 ,  G06T1/60 ,  G06T15/005

Abstract: Embodiments are generally directed to thread group scheduling for graphics processing. An embodiment of an apparatus includes a plurality of processors including a plurality of graphics processors to process data; a memory; and one or more caches for storage of data for the plurality of graphics processors, wherein the one or more processors are to schedule a plurality of groups of threads for processing by the plurality of graphics processors, the scheduling of the plurality of groups of threads including the plurality of processors to apply a bias for scheduling the plurality of groups of threads according to a cache locality for the one or more caches.

公开(公告)号：US20230088743A1

公开(公告)日：2023-03-23

申请号：US17481448

申请日：2021-09-22

Applicant: Intel Corporation

Inventor： Supratim Pal ,  Chandra Gurram ,  Fan-Yin Tzeng ,  Subramaniam Maiyuran ,  Guei-Yuan Lueh ,  Timothy R. Bauer ,  Vikranth Vemulapalli ,  Wei-Yu Chen

IPC: G06F9/30 ,  G06F9/38 ,  G06F12/02 ,  G06T1/20

Abstract: An apparatus to facilitate gathering payload from arbitrary registers for send messages in a graphics environment is disclosed. The apparatus includes processing resources comprising execution circuitry to receive a send gather message instruction identifying a number of registers to access for a send message and identifying IDs of a plurality of individual registers corresponding to the number of registers; decode a first phase of the send gather message instruction; based on decoding the first phase, cause a second phase of the send gather message instruction to bypass an instruction decode stage; and dispatch the first phase subsequently followed by dispatch of the second phase to a send pipeline. The apparatus can also perform an immediate move of the IDs of the plurality of individual registers to an architectural register of the execution circuitry and include a pointer to the architectural register in the send gather message instruction.

公开(公告)号：US11210094B2

公开(公告)日：2021-12-28

申请号：US16585427

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Michael Cole ,  Alexandr Kurylev ,  Subramaniam Maiyuran ,  Vikranth Vemulapalli ,  Sriharsha Vadlamani ,  Piotr Reiter

IPC: G06F9/38 ,  G06F9/50 ,  G06T1/20 ,  G06F9/30 ,  G06F12/0815 ,  G06F8/41

Abstract: Systems and methods for minimally intrusive instruction pointer-aware processing resource activity profiling are disclosed. In one embodiment, a graphics processor includes a grouping of processing resources and control logic that is associated with the grouping of processing resources. The control logic is configured to sample a state of at least one processing resource of the grouping of processing resources and to determine activity data from the state with the activity data including at least one of stalls and reason counts for stalling activity, instruction types, pipeline utilization, thread utilization, and shader activity.

公开(公告)号：US20210374897A1

公开(公告)日：2021-12-02

申请号：US17303654

申请日：2021-06-03

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Scott Janus ,  Varghese George ,  Subramaniam Maiyuran ,  Altug Koker ,  Abhishek Appu ,  Prasoonkumar Surti ,  Vasanth Ranganathan ,  Andrei Valentin ,  Ashutosh Garg ,  Yoav Harel ,  Arthur Hunter, JR. ,  SungYe Kim ,  Mike Macpherson ,  Elmoustapha Ould-Ahmed-Vall ,  William Sadler ,  Lakshminarayanan Striramassarma ,  Vikranth Vemulapalli

IPC: G06T1/20 ,  G06F9/50 ,  G06F12/0806 ,  G06F15/80 ,  G06F17/16 ,  G06N3/04 ,  G06N3/08 ,  G06F7/544

Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.

公开(公告)号：US20200294180A1

公开(公告)日：2020-09-17

申请号：US16355303

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

公开(公告)号：US20190265973A1

公开(公告)日：2019-08-29

申请号：US15903283

申请日：2018-02-23

Applicant: Intel Corporation

Inventor： Subramaniam Maiyuran ,  Supratim Pal ,  Ashutosh Garg ,  Darin M. Starkey ,  Guei-Yuan Lueh ,  Jorge E. Parra ,  Shubh B. Shah ,  Wei-Yu Chen ,  Vikranth Vemulapalli ,  Narsim Krishna ,  Brent A. Schwartz ,  Chandra S. Gurram ,  Wei Pan ,  Ashwin J. Shivani

IPC: G06F9/30 ,  G06F9/38 ,  G06T1/20

Abstract: Methods and apparatus relating to techniques for fusing SIMD processing units. In an example, an apparatus comprises logic, at least partially comprising hardware logic, to receive an instruction set for execution on at least two graphics processing execution units, determine whether the instruction set requires data dependent addressing, and select between a synchronized execution environment for the at least two graphics processing units and an unsynchronized execution environment for the at least two graphics processing units based at least in part on the determination whether the instruction set requires data dependent addressing. Other embodiments are also disclosed and claimed.

公开(公告)号：US12141890B2

公开(公告)日：2024-11-12

申请号：US17685117

申请日：2022-03-02

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.