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公开(公告)号:JP2006343709A
公开(公告)日:2006-12-21
申请号:JP2005262997
申请日:2005-09-09
Applicant: JSR CORP
Inventor: ISHIKAWA MASAYOSHI , HANAMURA MASAAKI , SHIRAKI SHINJI , KAJITA TORU
Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition capable of forming microlenses excellent in thickness, resolution, pattern shape, heat resistance, transparency, heat discoloration resistance, solvent resistance, and also capable of having good storage stability. SOLUTION: The radiation sensitive resin composition comprises: (A) an alkali-soluble copolymer obtained by polymerizing 100 wt.%, in total, of 10-50 wt.% of a polymerizable unsaturated compound (a) having an acidic functional group, 20-60 wt.% of a polymerizable unsaturated compound (b) having an alicyclic hydrocarbon group but not having an acidic functional group and 5-40 wt.% of another polymerizable unsaturated compound (c); (B) a polymerizable unsaturated compound including a polymerizable unsaturated compound having an alicyclic hydrocarbon group but not having an acidic functional group as an essential component; and (C) a photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT