Abstract:
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
Abstract:
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a cured film excellent in extensibility, a polymer suitable as a component contained in the composition, a cured film formed from the composition, and an electronic part having the cured film.SOLUTION: A resin composition contains (A) a polymer having a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2), and (F) a solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a novel radiation sensitive composition for forming a colored layer having excellent adhesiveness to a substrate and solvent resistance, which imparts pixels and a black matrix free from generation of development residue even when the luminous energy of exposure is low.SOLUTION: A radiation sensitive composition for forming a colored layer contains (A) a colorant, (B) an alkali-soluble resin, (C) a polyfunctional monomer, (D) a photopolymerization initiator and (E) a siloxane oligomer obtained by hydrolyzing an alkoxy silane expressed by formula (1) and formula (2). In the formulae, Rrepresents a substituent containing at least one functional group selected from a group consisting of an oxiranyl group, oxetanyl group, episulfide group, vinyl group, allyl group, (meth)acryloyl group, carboxyl group, hydroxyl group, mercapto group, isocyanate group, amino group, ureido group and styryl group.
Abstract:
PROBLEM TO BE SOLVED: To provide: a positive radiation-sensitive composition which is based on polysiloxane, allows formation of an interlayer insulation film having high flatness or evenness of thickness without application irregularity, and has excellent radiation-sensitivity and development margin; the interlayer insulating film formed of the composition; and a method of forming the interlayer insulation film. SOLUTION: The positive radiation-sensitive composition includes a copolymer compound having a structural unit derived from: [A] a siloxane polymer; [B] a quinone-diazide compound; and [C] a polymer compound having (c1) alkyl fluoride (meta)acrylate monomer, (c2) (meta)acrylate monomer including oxyalkylene group in its side chain, and (c3) siloxane group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a polysiloxane based positive radiation sensitive composition which can form an interlayer insulation film having superior radiation sensitivity melt flow-proofness, high heat resistance, transparency or the like.SOLUTION: The positive radiation sensitive composition includes [A] siloxane polymer being a hydrolyzable silane compound and/or its hydrolysis condensate, [B] a bissilane compound of structure coupled with a 1C-6C alkylene group, a phenylene group and 1, 4-dialkyl phenylene group, and [C] a quinonediazide compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition having high radiation sensitivity and such a development margin as to form a good pattern shape even by development for over an optimum developing time in a developing step, the composition easily forming a patterned thin film excellent in adhesion and being suitable for forming an interlayer dielectric or microlenses. SOLUTION: The radiation-sensitive resin composition includes a polysiloxane having a polymerizable unsaturated bond and a 1,2-quinonediazide compound. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is suitably used for simultaneously forming protrusions and spacers of a vertical alignment liquid crystal display element. SOLUTION: The radiation-sensitive resin composition for simultaneously forming the protrusions and the spacers for the vertical alignment liquid crystal display element contains: a copolymer [A] of an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride (a1), an epoxy group containing unsaturated compound (a2), an unsaturated compound (a3) expressed by a formula (1) (in the formula, R 1 is a hydrogen atom or a methyl group, R 2 , R 3 and R 4 are independently a hydrogen atom, a hydroxyl group, or a 1-6C alkyl or alkoxyl group, n is an integer of 0-6); and an olefinically unsaturated compound (a4) other than (a1), (a2) and (a3), and [B] a 1,2-quinone diazide compound. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide wafer fixing pellets and a semiconductor wafer processing method using the same wherein a semiconductor wafer is brought into close contact with a base such as a hard plate, an elastic carrier (packing material), or a wafer and fixed so as to be held when the wafer is processed, the wafer as a work is easily separated, a fixing agent layer attached to the wafer is easily removed, the wafer is easily cleaned, and the wafer as the work is kept free from contamination. SOLUTION: The wafer fixing pellets contain liquid crystal compounds. The pellets interposed between the semiconductor wafer and the base where the wafer is fixed are heated to be melted, and the wafer and the base are brought into close contact with each other and fixed with each other. After the exposed surface of the wafer is subjected to processing, the wafer is separated from the base and cleaned. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition having a sufficient sensitivity, to provide an interlayer insulating film that uses the positive radiation-sensitive resin composition, has a superior melt flow resistance, heat resistance, and solvent resistance and has a superior voltage holding ratio, and to provide a formation method thereof.SOLUTION: The positive radiation-sensitive resin composition according to the present invention includes: [A1] polyorganosiloxane in which a content ratio of an organic group having an epoxy group out of organic groups bonded to silicon atom at a carbon atom is equal to or greater than 0 mol% but less than 50 mol% and [A2] polyorganosiloxane in which the content ratio of the same is equal to or greater than 50 mol% but less than 100 mol%.