公开(公告)号：US20180042103A1

公开(公告)日：2018-02-08

申请号：US15783191

申请日：2017-10-13

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

公开(公告)号：US20160309577A1

公开(公告)日：2016-10-20

申请号：US14704115

申请日：2015-05-05

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Abstract translation: 在示例性实施例中，电路组件可以设置在诸如板级屏蔽，中板，支架，精密金属部件等的导电结构上和/或由其支撑。例如，可以提供电路组件 在板级屏蔽的外顶表面上和/或支撑。 在示例性实施例中，组件通常包括被配置用于电子设备中的第一功能的导电结构。 导电层至少部分在导电结构上。 第一电气部件至少部分地在非导电层上并且被配置为限定用于与电子设备的一个或多个第二电气部件电连接的电路组件的至少一部分。 因此，导电结构可以被配置用于电子设备中的第二功能。