公开(公告)号：IL173540A

公开(公告)日：2010-04-15

申请号：IL17354006

申请日：2006-02-05

Applicant: LAM RES CORP ,  PERRY ANDREW ,  STEGER ROBERT ,  BENJAMIN NEIL

Inventor： PERRY ANDREW ,  STEGER ROBERT ,  BENJAMIN NEIL

IPC: G01C1/00 ,  H01L21/68

公开(公告)号：SG10201601518UA

公开(公告)日：2016-04-28

申请号：SG10201601518U

申请日：2006-11-01

Applicant: LAM RES CORP

Inventor： STEGER ROBERT

公开(公告)号：AT459975T

公开(公告)日：2010-03-15

申请号：AT03797912

申请日：2003-09-16

Applicant: LAM RES CORP

Inventor： STEGER ROBERT

IPC: H01J37/32 ,  H05H1/46 ,  C23C16/50 ,  H01L21/3065

Abstract: A method for processing a plurality of substrates in a plasma processing chamber of a plasma processing system, each of the substrate being disposed on a chuck and surrounded by an edge ring during the processing. The method includes processing a first substrate of the plurality of substrates in accordance to a given process recipe in the plasma processing chamber. The method further includes adjusting, thereafter, a capacitance value of a capacitance along a capacitive path between a plasma sheath in the plasma processing chamber and the chuck through the edge ring by a given value. The method additionally includes processing a second substrate of the plurality of substrates in accordance to the given process recipe in the plasma processing chamber after the adjusting, wherein the adjusting is performed without requiring a change in the edge ring.