公开(公告)号：US20240266491A1

公开(公告)日：2024-08-08

申请号：US18681712

申请日：2021-08-27

Applicant: LG ELECTRONICS INC.

Inventor： Indo CHUNG ,  Yongdae KIM ,  Youngdo KIM

IPC: H01L33/62 ,  G06F1/16 ,  H01L25/075

CPC classification number: H01L33/62 ,  G06F1/1652 ,  H01L25/0753

Abstract: The display device can include a substrate, a first insulating layer on the substrate, first and second assembling wirings on the substrate, a second insulating layer disposed on the first and second assembling wirings and having a first hole and at least one or more second hole extending in a lateral direction of the first hole, a semiconductor light emitting device in the first hole, and a connection electrode in the second hole.

公开(公告)号：US20230215982A1

公开(公告)日：2023-07-06

申请号：US18093700

申请日：2023-01-05

Applicant: LG ELECTRONICS INC. ,  LG Display Co., Ltd.

Inventor： Sunyong SONG ,  Wonseok CHOI ,  Jeonghyo KWON ,  Junoh SHIN ,  Youngdo KIM

IPC: H01L33/38 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/62

Abstract: Discussed is a display device including a semiconductor light emitting device. A display device can include a substrate, first assembly electrodes, second assembly electrodes and the first assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed on the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the insulating layer, a plating layer electrically connected to the first assembly electrode and the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the first assembly electrode and the second assembly electrode by the plating layer.

公开(公告)号：US20230130868A1

公开(公告)日：2023-04-27

申请号：US17971422

申请日：2022-10-21

Applicant: LG ELECTRONICS INC.

Inventor： Dohwan YANG ,  Hongcheol LEE ,  Youngdo KIM

IPC: H01L33/62 ,  H01L25/075

Abstract: A display device can include first and second assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed between the first assembly electrode and the second assembly electrode, an assembly barrier wall disposed on the first assembly electrode, the second assembly electrode, the insulating layer and having an assembly hole, an annealed light-transmitting electrode layer disposed on the first assembly electrode and a semiconductor light emitting device disposed in contact with the annealed light-transmitting electrode layer.

公开(公告)号：US20220352445A1

公开(公告)日：2022-11-03

申请号：US17619852

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Gunho KIM ,  Bongchu SHIM ,  Youngdo KIM

IPC: H01L33/62 ,  H01L33/00 ,  H01L27/15 ,  H01L33/38

Abstract: Discussed is an assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes; and a voltage applying unit connected to at least opposite ends of the plurality of assembly electrodes to apply one or more voltage signals to the plurality of assembly electrodes, wherein a voltage signal of the same polarity is applied to the plurality of assembly electrodes from the voltage applying unit connected to the opposite ends.