公开(公告)号：US20220278082A1

公开(公告)日：2022-09-01

申请号：US17632058

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohee KIM ,  Gunho KIM ,  Yongil SHIN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L23/00

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

公开(公告)号：US20230268456A1

公开(公告)日：2023-08-24

申请号：US18012823

申请日：2020-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Jinhyung LEE ,  Gunho KIM ,  Jungsub KIM

IPC: H01L33/00 ,  H01L33/48 ,  H01L25/075 ,  H01L33/20 ,  H01L33/16

CPC classification number: H01L33/0093 ,  H01L25/0753 ,  H01L33/16 ,  H01L33/20 ,  H01L33/483

Abstract: Discussed is a substrate for manufacturing a display apparatus, and the substrate can include a base portion, pair electrodes disposed on the base portion to extend in an extension direction, a dielectric layer disposed on the base portion to cover the pair electrodes, a partition wall portion disposed on the dielectric layer, and cells defined by the partition wall portion, and arranged to overlap the pair electrodes along the extension direction of the pair electrodes. The pair electrodes are arranged at different intervals.

公开(公告)号：US20250160087A1

公开(公告)日：2025-05-15

申请号：US18839220

申请日：2022-02-17

Applicant: LG ELECTRONICS INC.

Inventor： Gunho KIM ,  Bongchu SHIM ,  Yongil SHIN ,  Jungsub KIM

IPC: H10H29/03 ,  C25D13/12 ,  C25D13/18 ,  H01L21/67

Abstract: A manufacturing device for a display device comprises: a chamber in which a display substrate is installed and comprises a fluid; a magnetic member on one side of the display substrate; And a signal supply device is included, wherein the signal supply device modulates a first alternating current signal into a second alternating current signal and supplies the modulated second alternating current signal to electrode wiring of the display substrate, and the second alternating current signal periodically changes a dielectrophoretic force to attach and detach a plurality of semiconductor light-emitting elements contained in the fluid to a plurality of assembly holes of the display substrate, respectively.

公开(公告)号：US20180309017A1

公开(公告)日：2018-10-25

申请号：US15959974

申请日：2018-04-23

Applicant: LG ELECTRONICS INC.

Inventor： Wonseok CHOI ,  Gunho KIM

IPC: H01L31/18 ,  H01L31/068 ,  H01L31/0735 ,  H01L31/0687 ,  H01L31/0304

CPC classification number: H01L31/1844 ,  H01L31/03042 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/0735 ,  Y02E10/544 ,  Y02P70/521

Abstract: Disclosed is a method of manufacturing a compound semiconductor solar cell according to an embodiment of the invention. The method of manufacturing the compound semiconductor solar cell according to the embodiment of the invention includes forming a plurality of compound semiconductor layers of at least two elements and including a base layer and an emitter layer, the base layer including a first conductivity type dopant to have a first conductivity type and the emitter layer including a second conductivity type dopant to have a second conductivity type. The forming of the plurality of compound semiconductor layers includes at least one of a process-temperature change period and a growth-rate change period.

公开(公告)号：US20180248059A1

公开(公告)日：2018-08-30

申请号：US15904019

申请日：2018-02-23

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Gunho KIM ,  Hyun LEE ,  Wonseok CHOI ,  Younho HEO

IPC: H01L31/0352 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/0735

CPC classification number: H01L31/035281 ,  H01L31/022425 ,  H01L31/0735 ,  H01L31/184 ,  H01L31/1844 ,  H01L31/186 ,  H01L31/1892 ,  Y02E10/544 ,  Y02P70/521

Abstract: A compound semiconductor solar cell and a method of manufacturing the same are disclosed. The compound semiconductor solar cell includes a compound semiconductor layer, a front electrode positioned on a front surface of the compound semiconductor layer, a back electrode positioned on a back surface of the compound semiconductor layer, a defect portion disposed within the compound semiconductor layer and physically and electrically connected to the back electrode, and an isolation portion surrounding the defect portion.

公开(公告)号：US20230059135A1

公开(公告)日：2023-02-23

申请号：US17784271

申请日：2020-01-31

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Bongchu SHIM ,  Gunho KIM

IPC: H01L33/48 ,  H01L25/16

Abstract: A method for manufacturing a display device related to a micro-light-emitting diode (micro-LED) according to an embodiment of the present disclosure comprises the steps of: moving an assembly device comprising a magnetic body, while the assembly device is in contact or not in contact with an assembly substrate (a chamber filled with fluid is positioned below the assembly device and the assembly substrate, wherein a plurality of specific semiconductor light-emitting diodes are included in the chamber); on the basis of a magnetic field generated by the assembly device, moving the plurality of specific semiconductor light-emitting diodes in the chamber in a direction in which the assembly substrate is positioned; arranging, in first-type assembly grooves in the assembly substrate, a first group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes; and arranging, in second-type assembly grooves in the assembly substrate, a second group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes.

公开(公告)号：US20220352445A1

公开(公告)日：2022-11-03

申请号：US17619852

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Gunho KIM ,  Bongchu SHIM ,  Youngdo KIM

IPC: H01L33/62 ,  H01L33/00 ,  H01L27/15 ,  H01L33/38

Abstract: Discussed is an assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes; and a voltage applying unit connected to at least opposite ends of the plurality of assembly electrodes to apply one or more voltage signals to the plurality of assembly electrodes, wherein a voltage signal of the same polarity is applied to the plurality of assembly electrodes from the voltage applying unit connected to the opposite ends.

公开(公告)号：US20220223437A1

公开(公告)日：2022-07-14

申请号：US17612881

申请日：2019-05-28

Applicant: LG ELECTRONICS INC.

Inventor： Hyunho LEE ,  Bongchu SHIM ,  Gunho KIM

IPC: H01L21/67 ,  H01L25/075

Abstract: A self-assembly apparatus and method of the present invention for semiconductor light-emitting devices can separate semiconductor light-emitting devices attached to each other by vibrating a fluid during self-assembly to thereby prevent mis-assembly and, for smooth assembly of the semiconductor light emitting devices, generate a flow of the fluid along the movement direction of a magnet. The self-assembly apparatus comprises: a chamber in which a plurality of semiconductor light-emitting devices comprising a magnetic substance and a fluid are accommodated; a transfer unit for transferring, to an assembly location, a substrate on which the semiconductor light-emitting devices are to be assembled; a magnet spaced apart from the chamber to apply a magnetic force to the semiconductor light-emitting devices; a location control unit for controlling a location of the magnet; and a vibration generation unit for generating vibration in the fluid to thereby separate the semiconductor light-emitting devices from each other.

公开(公告)号：US20180342633A1

公开(公告)日：2018-11-29

申请号：US15988478

申请日：2018-05-24

Applicant: LG ELECTRONICS INC.

Inventor： Wonseok CHOI ,  Gunho KIM

IPC: H01L31/0304 ,  H01L31/0224

Abstract: There is provided a compound semiconductor solar cell, comprising: a top cell including a compound semiconductor layer; a front electrode located on a front surface of the top cell and including a plurality of finger electrodes; and a back electrode disposed on a back surface of the top cell, wherein the top cell including a first window layer positioned on a light receiving surface of the top cell, a first base layer containing impurities of a first conductive type and located on a back surface of the first window layer, and a first emitter layer containing impurities of a second conductive type opposite the first conductive type and located on a back surface of the first base layer to form a p-n junction with the first base layer, wherein the first base layer includes a first layer having a first electrical conductivity and a second layer having a second electrical conductivity different from the first electrical conductivity, and wherein an interval between the second layer and the first emitter layer is larger than an interval between the first layer and the first emitter layer. The second electrical conductivity of the second layer may be higher than the first electrical conductivity of the first layer.

公开(公告)号：US20240332475A1

公开(公告)日：2024-10-03

申请号：US18697320

申请日：2021-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Changseo PARK ,  Gunho KIM ,  Yongil SHIN ,  Yoonchul KIM

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: The display device includes a substrate, first assembly wiring, second assembly wiring, a partition, and first to third semiconductor light emitting devices. Each of the plurality of pixels includes first to third sub-pixels. The first to third assembly holes are located in the first to third sub-pixels. The first assembly wiring includes a first bus wiring in a plurality of pixels, and a plurality of first branch wirings branching from the first bus wiring. The second assembly wiring includes a second bus wiring in a plurality of pixels, and a plurality of second branch wirings branching from the second bus wiring. Each of the first to third semiconductor light emitting devices may be disposed in first to third assembly holes between the first bus wiring, the second bus wiring, the first branch wiring, and the second branch wiring.