公开(公告)号：US10456814B2

公开(公告)日：2019-10-29

申请号：US16182429

申请日：2018-11-06

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC: B08B9/08 ,  B08B3/08 ,  C11D3/16 ,  G01N27/414 ,  C11D3/34 ,  C11D3/43 ,  C11D1/22 ,  C11D11/00 ,  H01L21/02 ,  C11D7/50 ,  C11D7/34 ,  B05D3/00 ,  B05D5/12

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

公开(公告)号：US10809225B2

公开(公告)日：2020-10-20

申请号：US14789795

申请日：2015-07-01

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Ronald L. Cicero ,  Marc Glazer ,  Yufang Wang ,  Christina E. Inman ,  Jeremy Gray ,  Joseph Koscinski ,  James A. Ball ,  Phil Waggoner ,  Alexander Mastroianni

IPC: G01N27/414

Abstract: A sensor component includes a sensor including a sensor surface and a reaction site in cooperation with the sensor and exposing the sensor surface. The reaction site including a reaction site surface. A surface agent is bound to the reaction site surface or the sensor surface. The surface agent includes a surface active functional group reactive with Bronsted base or Lewis acid functionality on the reaction site surface or the sensor surface and including distal functionality that does not have a donor electron pair.

公开(公告)号：US10724086B2

公开(公告)日：2020-07-28

申请号：US15061273

申请日：2016-03-04

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Phil Waggoner ,  James A. Ball ,  Wolfgang Hinz ,  Michael L. Minto ,  Scott Parker ,  David M. Cox ,  Alexander Mastroianni ,  Jeremy Gray ,  Marc Glazer ,  Kimberly Gorrell

IPC: C12Q1/6869 ,  G01N27/414

Abstract: A sensor apparatus includes a substrate, a semiconductor device disposed over the substrate, the semiconductor device having a surface electrode structure, and a saccharide coating formed over the surface electrode structure. The saccharide coating can be removed prior to use. The semiconductor device can further include a well and optionally a bead disposed in the well.

公开(公告)号：US10483123B2

公开(公告)日：2019-11-19

申请号：US15945707

申请日：2018-04-04

Applicant: Life Technologies Corporation

Inventor： Phil Waggoner ,  Jordan Owens

IPC: H01L21/311 ,  G01N27/414 ,  H01L21/02 ,  H01L21/027 ,  H01L21/285 ,  H01L21/3213

Abstract: A method for forming a well providing access to a sensor pad includes patterning a first photoresist layer over a dielectric structure disposed over the sensor pad; etching a first access into the dielectric structure and over the sensor pad, the first access having a first characteristic diameter; patterning a second photoresist layer over the dielectric structure; and etching a second access over the dielectric structure and over the sensor pad. The second access has a second characteristic diameter. The first and second accesses overlapping. A diameter ratio of the first characteristic diameter to the second characteristic diameter is not greater than 0.7. The first access exposes the sensor pad. The second access has a bottom depth less than a bottom depth of the first access.

公开(公告)号：US20190070640A1

公开(公告)日：2019-03-07

申请号：US16182429

申请日：2018-11-06

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC: B08B3/08 ,  C11D11/00 ,  B08B9/08 ,  C11D1/22 ,  C11D3/16 ,  C11D3/43 ,  H01L21/02 ,  G01N27/414 ,  C11D3/34 ,  B05D5/12 ,  C11D7/34 ,  C11D7/50 ,  B05D3/00

CPC classification number: B08B3/08 ,  B05D3/00 ,  B05D5/12 ,  B08B9/08 ,  C11D1/22 ,  C11D3/162 ,  C11D3/3418 ,  C11D3/43 ,  C11D7/34 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/02057

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

公开(公告)号：US10137480B2

公开(公告)日：2018-11-27

申请号：US15387591

申请日：2016-12-21

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC: B08B7/00 ,  B08B3/08 ,  B08B9/08 ,  C11D3/16 ,  G01N27/414 ,  C11D3/34 ,  C11D3/43 ,  C11D1/22 ,  C11D11/00 ,  H01L21/02 ,  C11D7/50 ,  C11D7/34 ,  B05D3/00 ,  B05D5/12

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

公开(公告)号：US09555451B2

公开(公告)日：2017-01-31

申请号：US15079532

申请日：2016-03-24

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC: B08B7/00 ,  B08B3/08 ,  B08B9/08 ,  C11D3/16 ,  C11D3/34 ,  C11D3/43 ,  G01N27/414 ,  C11D7/50 ,  C11D7/34

CPC classification number: B08B3/08 ,  B05D3/00 ,  B05D5/12 ,  B08B9/08 ,  C11D1/22 ,  C11D3/162 ,  C11D3/3418 ,  C11D3/43 ,  C11D7/34 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/02057

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

Abstract translation: 一种处理包括多个传感器和隔离结构的传感器阵列的方法，其中所述多个传感器中的传感器具有在所述传感器阵列的表面处暴露的传感器垫，并且所述隔离结构设置在所述传感器垫和传感器垫之间 所述多个传感器中的其它传感器包括将所述传感器垫和所述隔离结构暴露于包括有机硅化合物和第一非水载体的非水有机硅溶液; 将包含有机酸和第二非水性载体的酸溶液施加到传感器垫; 以及从传感器垫和隔离结构冲洗酸溶液。