公开(公告)号：US11441178B2

公开(公告)日：2022-09-13

申请号：US16824920

申请日：2020-03-20

Applicant: Life Technologies Corporation

Inventor： Phil Waggoner ,  James A. Ball ,  Wolfgang Hinz ,  Michael L. Minto ,  Scott Parker ,  David M. Cox ,  Alexander Mastroianni ,  Jeremy Gray ,  Marc Glazer ,  Kimberly Gorrell

IPC: C12Q1/6869 ,  G01N27/414

Abstract: A sensor apparatus includes a substrate, a semiconductor device disposed over the substrate, the semiconductor device having a surface electrode structure, and a saccharide coating formed over the surface electrode structure. The saccharide coating can be removed prior to use. The semiconductor device can further include a well and optionally a bead disposed in the well.

公开(公告)号：US12140557B2

公开(公告)日：2024-11-12

申请号：US17267772

申请日：2019-08-16

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Phil Waggoner ,  Jordan Owens ,  Scott Parker

IPC: G01N27/414 ,  H01L21/28 ,  H01L21/3065

Abstract: A method for manufacturing a sensor includes etching an insulator layer disposed over a substrate to define an opening exposing a sensor surface of a sensor disposed on the substrate, a native oxide forming on the sensor surface; sputtering the sensor surface with a noble gas to at least partially remove the native oxide from the sensor surface; and annealing the sensor surface in a hydrogen atmosphere.

公开(公告)号：US11782019B2

公开(公告)日：2023-10-10

申请号：US17060680

申请日：2020-10-01

Applicant: Life Technologies Corporation

Inventor： Ronald L. Cicero ,  Marc Glazer ,  Yufang Wang ,  Christina E Inman ,  Jeremy Gray ,  Joseph Koscinski ,  James A. Ball ,  Phil Waggoner ,  Alexander Mastroianni

IPC: G01N27/414

CPC classification number: G01N27/4145

Abstract: A sensor component includes a sensor including a sensor surface and a reaction site in cooperation with the sensor and exposing the sensor surface. The reaction site including a reaction site surface. A surface agent is bound to the reaction site surface or the sensor surface. The surface agent includes a surface active functional group reactive with Bronsted base or Lewis acid functionality on the reaction site surface or the sensor surface and including distal functionality that does not have a donor electron pair.

公开(公告)号：US20180366340A1

公开(公告)日：2018-12-20

申请号：US15945707

申请日：2018-04-04

Applicant: Life Technologies Corporation

Inventor： Phil Waggoner ,  Jordan Owens

IPC: H01L21/311 ,  H01L21/027 ,  H01L21/02 ,  H01L21/285 ,  H01L21/3213 ,  G01N27/414

CPC classification number: H01L21/31144 ,  G01N27/4146 ,  G01N27/4148 ,  H01L21/0206 ,  H01L21/0271 ,  H01L21/28556 ,  H01L21/31111 ,  H01L21/32133

Abstract: A method for forming a well providing access to a sensor pad includes patterning a first photoresist layer over a dielectric structure disposed over the sensor pad; etching a first access into the dielectric structure and over the sensor pad, the first access having a first characteristic diameter; patterning a second photoresist layer over the dielectric structure; and etching a second access over the dielectric structure and over the sensor pad. The second access has a second characteristic diameter. The first and second accesses overlapping. A diameter ratio of the first characteristic diameter to the second characteristic diameter is not greater than 0.7. The first access exposes the sensor pad. The second access has a bottom depth less than a bottom depth of the first access.

公开(公告)号：US20230037531A1

公开(公告)日：2023-02-09

申请号：US17818869

申请日：2022-08-10

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Phil Waggoner ,  James A. Ball ,  Wolfgang Hinz ,  Michael L. Minto ,  Scott Parker ,  David M. Cox ,  Alexander Mastroianni ,  Jeremy Gray ,  Marc Glazer ,  Kimberly Gorrell

IPC: C12Q1/6869 ,  G01N27/414

Abstract: A sensor apparatus includes a substrate, a semiconductor device disposed over the substrate, the semiconductor device having a surface electrode structure, and a saccharide coating formed over the surface electrode structure. The saccharide coating can be removed prior to use. The semiconductor device can further include a well and optionally a bead disposed in the well.

公开(公告)号：US11004690B2

公开(公告)日：2021-05-11

申请号：US16687630

申请日：2019-11-18

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Phil Waggoner ,  Jordan Owens

IPC: H01L21/311 ,  G01N27/414 ,  H01L21/02 ,  H01L21/027 ,  H01L21/285 ,  H01L21/3213

Abstract: A method for forming a well providing access to a sensor pad includes patterning a first photoresist layer over a dielectric structure disposed over the sensor pad; etching a first access into the dielectric structure and over the sensor pad, the first access having a first characteristic diameter; patterning a second photoresist layer over the dielectric structure; and etching a second access over the dielectric structure and over the sensor pad. The second access has a second characteristic diameter. The first and second accesses overlapping. A diameter ratio of the first characteristic diameter to the second characteristic diameter is not greater than 0.7. The first access exposes the sensor pad. The second access has a bottom depth less than a bottom depth of the first access.

公开(公告)号：US10828679B2

公开(公告)日：2020-11-10

申请号：US16663099

申请日：2019-10-24

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： James A. Ball ,  Phil Waggoner ,  Scott Parker

IPC: G01N27/414 ,  B08B3/08 ,  B08B9/08 ,  C11D3/16 ,  C11D3/34 ,  C11D3/43 ,  C11D1/22 ,  C11D11/00 ,  H01L21/02 ,  C11D7/50 ,  C11D7/34 ,  B05D3/00 ,  B05D5/12

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

公开(公告)号：US11879156B2

公开(公告)日：2024-01-23

申请号：US17818869

申请日：2022-08-10

Applicant: LIFE TECHNOLOGIES CORPORATION

Inventor： Phil Waggoner ,  James A. Ball ,  Wolfgang Hinz ,  Michael L. Minto ,  Scott Parker ,  David M. Cox ,  Alexander Mastroianni ,  Jeremy Gray ,  Marc Glazer ,  Kimberly Gorrell

IPC: G01N27/414 ,  C12Q1/6869

CPC classification number: C12Q1/6869 ,  G01N27/4145 ,  C12Q1/6869 ,  C12Q2527/119 ,  C12Q2527/125 ,  C12Q2565/607

Abstract: A sensor apparatus includes a substrate, a semiconductor device disposed over the substrate, the semiconductor device having a surface electrode structure, and a saccharide coating formed over the surface electrode structure. The saccharide coating can be removed prior to use. The semiconductor device can further include a well and optionally a bead disposed in the well.

公开(公告)号：US20210102916A1

公开(公告)日：2021-04-08

申请号：US17060680

申请日：2020-10-01

Applicant: Life Technologies Corporation

Inventor： Ronald L. Cicero ,  Marc Glazer ,  Yufang Wang ,  Christina E. Inman ,  Jeremy Gray ,  Joseph Koscinski ,  James A. Ball ,  Phil Waggoner ,  Alexander Mastroianni

IPC: G01N27/414

Abstract: A sensor component includes a sensor including a sensor surface and a reaction site in cooperation with the sensor and exposing the sensor surface. The reaction site including a reaction site surface. A surface agent is bound to the reaction site surface or the sensor surface. The surface agent includes a surface active functional group reactive with Bronsted base or Lewis acid functionality on the reaction site surface or the sensor surface and including distal functionality that does not have a donor electron pair.

公开(公告)号：US20200216893A1

公开(公告)日：2020-07-09

申请号：US16824920

申请日：2020-03-20

Applicant: Life Technologies Corporation

Inventor： Phil Waggoner ,  James A. Ball ,  Wolfgang Hinz ,  Michael L. Minto ,  Scott Parker ,  David M. Cox ,  Alexander Mastroianni ,  Jeremy Gray ,  Marc Glazer ,  Kimberly Gorrell

IPC: C12Q1/6869 ,  G01N27/414

Abstract: A sensor apparatus includes a substrate, a semiconductor device disposed over the substrate, the semiconductor device having a surface electrode structure, and a saccharide coating formed over the surface electrode structure. The saccharide coating can be removed prior to use. The semiconductor device can further include a well and optionally a bead disposed in the well.