公开(公告)号：EP2183335A4

公开(公告)日：2016-03-23

申请号：EP08780074

申请日：2008-07-09

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  KAPADIA NILESH ,  CASTALDI STEVEN A

IPC: C09K13/00 ,  C23F1/00

CPC classification number: C23F1/18 ,  H05K3/383 ,  H05K2203/122

公开(公告)号：EP2132035A4

公开(公告)日：2016-03-23

申请号：EP08724545

申请日：2008-01-17

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  WANG MING DE ,  CASTALDI STEVEN A

IPC: B32B15/04 ,  B05D3/10 ,  B05D5/02 ,  C23C22/40 ,  C23C22/52 ,  C23F1/18

CPC classification number: C09J5/02 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2400/226 ,  C23C22/40 ,  C23C22/52 ,  C23F1/18 ,  H05K3/383 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile) polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.

公开(公告)号：EP1974370A4

公开(公告)日：2015-11-04

申请号：EP06814816

申请日：2006-09-15

Applicant: MACDERMID INC

Inventor： CASTALDI STEVEN A ,  FENG KESHENG ,  KAPADIA NILESH

IPC: H01L21/306 ,  C09K13/04 ,  C09K13/06 ,  C23F1/16 ,  C23F1/44 ,  H01L21/3213

CPC classification number: C23F1/18 ,  C23F1/16 ,  H01L21/32134 ,  H05K3/383 ,  H05K2203/122

Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

公开(公告)号：EP2304079A4

公开(公告)日：2011-07-27

申请号：EP09758853

申请日：2009-03-27

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  WANG MING DE ,  MCKIRRYHER COLLEEN ,  CASTALDI STEVEN A

IPC: H05K3/38 ,  C23F11/04 ,  C23G1/06

CPC classification number: H05K3/383 ,  C23F1/18 ,  C23F11/184 ,  H05K3/385 ,  H05K2203/0796 ,  H05K2203/124