公开(公告)号：ES2774149T3

公开(公告)日：2020-07-17

申请号：ES06814816

申请日：2006-09-15

Applicant: MACDERMID INC

Inventor： CASTALDI STEVEN ,  FENG KESHENG ,  KAPADIA NILESH

IPC: H01L21/306 ,  C09K13/04 ,  C09K13/06 ,  C23F1/16 ,  C23F1/44 ,  H01L21/3213

Abstract: Una composición de microdecapado para tratar superficies metálicas que comprenden: a) una fuente de iones cúpricos; b) ácido, en donde el ácido comprende un ácido seleccionado del grupo que consiste en ácido clorhídrico, ácido sulfúrico, ácido fosfórico, ácido nítrico, ácido fórmico, ácido acético, ácido sulfámico y ácido toluenosulfónico; c) un compuesto de nitrilo; y d) una fuente de iones de haluro.

公开(公告)号：ES2625131T3

公开(公告)日：2017-07-18

申请号：ES06771598

申请日：2006-05-31

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  KAPADIA NILESH ,  CASTALDI STEVE

IPC: C09K13/00

Abstract: Una solución de micrograbado acuosa que comprende: una fuente de ion cúprico; un derivado piridina; una multietilenamina; y un ácido, donde el derivado piridina se selecciona de picolina, 2-metilpiridina, 2-aminopiridina, 2-aminometilpiridina, 2- carboxipiridina, 4-metilpiridina, 4-aminopiridina y 4-aminometilpiridina.

公开(公告)号：WO2007078355A3

公开(公告)日：2007-11-15

申请号：PCT/US2006036185

申请日：2006-09-15

Applicant: MACDERMID INC

Inventor： CASTALDI STEVEN A ,  FENG KESHENG ,  KAPADIA NILESH

IPC: H01L21/306 ,  C09K13/04 ,  C09K13/06

CPC classification number: C23F1/18 ,  C23F1/16 ,  H01L21/32134 ,  H05K3/383 ,  H05K2203/122

Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

Abstract translation: 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其他添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括使铜或铜合金表面与本发明的组合物接触的步骤，然后粘合 聚合物材料到铜或铜合金表面。

公开(公告)号：EP2183335A4

公开(公告)日：2016-03-23

申请号：EP08780074

申请日：2008-07-09

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  KAPADIA NILESH ,  CASTALDI STEVEN A

IPC: C09K13/00 ,  C23F1/00

CPC classification number: C23F1/18 ,  H05K3/383 ,  H05K2203/122

公开(公告)号：EP1974370A4

公开(公告)日：2015-11-04

申请号：EP06814816

申请日：2006-09-15

Applicant: MACDERMID INC

Inventor： CASTALDI STEVEN A ,  FENG KESHENG ,  KAPADIA NILESH

IPC: H01L21/306 ,  C09K13/04 ,  C09K13/06 ,  C23F1/16 ,  C23F1/44 ,  H01L21/3213

CPC classification number: C23F1/18 ,  C23F1/16 ,  H01L21/32134 ,  H05K3/383 ,  H05K2203/122

Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

公开(公告)号：EP1920026A4

公开(公告)日：2012-01-25

申请号：EP06771598

申请日：2006-05-31

Applicant: MACDERMID INC

Inventor： FENG KESHENG ,  KAPADIA NILESH ,  CASTALDI STEVE

IPC: C09K13/00

CPC classification number: H05K3/383 ,  C09K13/06 ,  C23F1/18 ,  H05K2203/124