公开(公告)号：JPH1117089A

公开(公告)日：1999-01-22

申请号：JP18317697

申请日：1997-06-23

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: C23C14/14 ,  C23C14/34 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To form an Au layer or a mixed alloy layer of Pd and Au on the surface layer of a lead frame without using a plating processing by executing an Au plasma processing. SOLUTION: In the manufacture method of the lead frame where the Au layer is formed on the surface layer, a base metal layer 1 is formed and the Au layer 2 is formed by the Au plasma processing. Since the plating processing is not used for the formation of the Au layer 2, the Au layer 2 can be formed without the trouble of the rise of work cost and a trouble that the area of a work line is widely to be secured. In the manufacture method of the lead frame where a mixed alloy layer of Pd and Au is formed on the surface layer, the Pd layer 1 is formed and the Au plasma processing is executed. Thus, the mixed alloy layer of Pd and Au is formed. Thus, the number of work processes can be reduced and the plating processing is not used for the formation of the mixed alloy layer of Pd and Au. Consequently, the trouble of the rise of work cost and the trouble that the area of the work line is widely to be secured do not occur.

公开(公告)号：JPH1022324A

公开(公告)日：1998-01-23

申请号：JP16949296

申请日：1996-06-28

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  YOSHIMOTO YUKIRO ,  IWAMI TAKAYUKI

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/34

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which is easily manufactured and easily mounted with high reliability when integration and precision are high. SOLUTION: This device is constituted of a circuit board provided with a plurality of leads constituting a conducting circuit pattern 1 on the back of an insulating member 2, a retaining board 4 stuck on the surface of the insulating member 2, whose sticking surface constitutes a conducting layer, and a semiconductor chip 3 electrically connected with the circuit board. In this case, at least one through hole H is formed in a specified region of the circuit board, the retaining board 4 has a protrusion 4S protruding on the back of the circuit board, at a position corresponding to the through hole H, and a solder ball 5 is arranged on the tip part of the protrusion 4S.

公开(公告)号：JPH0888295A

公开(公告)日：1996-04-02

申请号：JP22352494

申请日：1994-09-19

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NAKAJIMA TAKASHI

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/02

Abstract: PURPOSE: To obtain a semiconductor device which is easily surface mounted and has high heat dissipation properties by using a conductor pattern at the center of a TAB board as a semiconductor chip placing part, providing an opening in a chip placing area in an insulating tape, exposing the conductor pattern, and integrally supporting the placing part and the periphery with the end of a lead. CONSTITUTION: A solder ball 5 protrudes from the contact hole of an insulating film 13 so formed as to cover the lead 1b of the peripheral edge of a TAB board, and further a conductor pattern disposed at the center of the board is remained as a semiconductor chip placing part 1a. Further, the insulating tape of the board has an opening at the chip placing area as well, the pattern is exposed, and the peripheral edge of the part 1a and the end of the lead are integrally supported except the bonding area of a lead 1b. In this case, a hole 7b is formed at the bonding area of the tape. Thus, the surface mounting is facilitated, and heat dissipation properties can be improved.

公开(公告)号：JPH0834276B2

公开(公告)日：1996-03-29

申请号：JP19887389

申请日：1989-07-31

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L21/56 ,  H01L23/50

公开(公告)号：JPH0864635A

公开(公告)日：1996-03-08

申请号：JP19556494

申请日：1994-08-19

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NAKAJIMA TAKASHI

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/50

Abstract: PURPOSE: To obtain a highly reliable semiconductor device which can be mounted easily even if the bonding pads are arranged at a fine pitch. CONSTITUTION: A semiconductor chip 3 and a metal board 4 are mounted on an insulating tape 2 having a conductor pattern formed on one side thereof, i.e., on the conductor pattern 1, forming side of a TAB board. Solder balls 5 are arranged on the rear side of the insulating tape 2 such that the solder balls are connected through holes H with a conductor pattern formed on the surface side.

公开(公告)号：JPH0766352A

公开(公告)日：1995-03-10

申请号：JP23568393

申请日：1993-08-27

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  TANABE SABURO

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To form a lead frame so that the front end sections of outer leads are highly accurately arranged the same in flatness without such deformation as twisting, one-side deviation, etc., by joining the front end sections of the outer leads with terminating sections of inner leads on the lead frame. CONSTITUTION:Inner leads 1 are formed by pressing or etching and their terminating sections 1a which are joined with outer leads are connected with the outer leads through connecting pieces 2. Since the outer leads 3 have broader widths than the inner leads 1 have and arranged at a boarder pitch than the leads 1, the leads 3 can be relatively easily formed. The terminating sections 1a of the inner leads 1 are integrally joined with the front end sections of the outer leads 3 with a joining material, such as conductive paste, etc. In a lead frame, the inner leads 1 are formed of metallic plates thinner and narrower than the outer leads 3 in a fine pattern and the outer leads 3 are formed of thicker plates of another metal having high heat conductivity. Therefore, the outer leads 3 have high processability.

公开(公告)号：JPH05226538A

公开(公告)日：1993-09-03

申请号：JP7939692

申请日：1992-02-14

Applicant: MITSUI HIGH TEC

Inventor： NOUZUMI ATSUO ,  FUKUI ATSUSHI ,  MURAKAMI KAZUYA

IPC: H01L23/50

Abstract: PURPOSE:To provide a device for cutting out a tie-bar without causing deformation, while hardly causing wear and damage, even if the number of leads of a semiconductor device is large and both width and spacing are narrow. CONSTITUTION:Relating to a cutting device far a tie-bar connecting a lead 10 of a semiconductor device 8, a liner 12 is provided to a rotational axis 11 whose thickness changes in accordance with a lead width, and further, multiple rotational cutter blades 13 whose thickness is less than lead 10 spacing are provided with the liner 12 in between far configuring a rotational cutting device. The rotational cutting device is allowed to freely get into/out of between leads 10 drawn from the semiconductor device 8. Since the rotational cutter blade 13 needs no work that grinds a blade tip on bath sides to form a sharp tip like a cut-punch, it is easily manufactured and hardly worn or damaged, thus excellent in workability. Even if the number of leads is large and both width and spacing are narrow, a tie-bar 5 is cut out with sure.

公开(公告)号：JPH0389539A

公开(公告)日：1991-04-15

申请号：JP22566189

申请日：1989-08-31

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L21/52 ,  H01L23/50

Abstract: PURPOSE:To improve the bonding property of a lead frame without deforming and deteriorating the inner lead of the frame by forming the front end of each inner lead shorter and replacing the front end section of each inner lead with a conductor pattern formed on an insulating film, and then, connecting them by wire bonding. CONSTITUTION:The main body R1 of this lead frame provided with numerous inner leads 1 arranged around an area for mounting a semiconductor element while being separated therefrom by a predetermined distance (longer than those for ordinary lead frames) and outer leads 3 is molded. Then a front end connecting section R2 is formed by forming gold patterns which are arranged corresponding to the front ends of the leads 1 and extended toward holes opened in the above-mentined area. The main body R1 and the connecting section R2 are placed on a heat sink 7 through an insulating tape 4 and the body R1 and the section R2 are joined to each other. After joining, both ends of the gold pattern 1P of the section R2 are connected respectively to the inner leads 1 of the main body section R1 and to the bonding pad of the semiconductor element 5 through wires.

公开(公告)号：JPH02202046A

公开(公告)日：1990-08-10

申请号：JP2119889

申请日：1989-01-31

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L21/60 ,  H01L23/50

Abstract: PURPOSE:To improve the heat dissipation property of a semiconductor element mounting part and to contrive the improvement of the reliability of a semiconductor device by a method wherein the semiconductor element mounting part with a roughness formed on its peripheral edge according to the configuration of the points of inner leads is supported by a support bar in such a way that it comes more downward than a lead part formation plane and moreover, its outer edge comes on the side more outer than a region surrounded with the points of the inner leads. CONSTITUTION:A semiconductor element mounting part is supported by a support bar 9 formed integrally with lead parts 4 and 8 in such a way as to come more downward than a lead part formation plane. Accordingly, the mounting part is formed in such a way as to have a roughness according to the presence or absence of the inner leads 4 and its heat dissipation property is enhanced in such a way that the outer peripheral edge of this mounting part cores on the side more outer than a region surrounded with the points of the inner leads 4. Therefore, even if the mounting part is formed large, the mounting part and the leads 4 do not come into contact to each other and intersect three-dimensionally. Thereby, the heat dissipation area of the mounting part becomes wide and a highly reliable semiconductor device with a semiconductor element, which is never deteriorated due to heat, is obtained.

公开(公告)号：JPH02202045A

公开(公告)日：1990-08-10

申请号：JP2119789

申请日：1989-01-31

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L21/60 ,  H01L23/50

Abstract: PURPOSE:To eliminate the residue of resin burrs and to contrive the improvement of the reliability by a lead frame by a method wherein after a strip material is subjected to form work into the form of the lead frame, the vicinities of the outside end parts of the resin sealing region of the inner leads of the lead frame are shaped in such a way that the corners of the outside end parts are formed at a right angle. CONSTITUTION:A strip material is subjected to form work so that it is formed into a lead frame comprising inner leads 12, outer leads 17 and tie bars and thereafter, a finishing molding, by which the vicinities of the outside end parts of the resin sealing regions of at least the inner leads 12 are shaped in such a way that the corners of the outside end parts are formed at a right angle, is performed. Accordingly, the intrusion of a resin 4 into the corners is eliminated and the residue of resin burrs can be inhibited. Thereby, the generation of such a bad effect as the resin burrs fall on the way to transportation to inflict an obstacle on the various functions of a transfer device or a cleaning of a factory is impeded is eliminated and the high reliability of the lead frame is obtained.