公开(公告)号：EP1198053A4

公开(公告)日：2008-02-27

申请号：EP01930191

申请日：2001-05-17

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  ISAYAMA MINAO

IPC: H02K1/18 ,  H02K1/14 ,  H02K15/02

CPC classification number: H02K15/024 ,  H02K1/146 ,  H02K15/022 ,  H02K2201/09 ,  Y10T29/49009 ,  Y10T29/49012 ,  Y10T29/49078 ,  Y10T29/5137 ,  Y10T83/0529

Abstract: A method of producing iron cores by punching out rotor iron core pieces and stator iron core pieces from one and the same thin metal sheet and laminating them, wherein the pole teeth of roughly punched-out stator iron core pieces are subjected to stable drawing by pressing on side of voids left by punching out the rotor iron core pieces, securing a sufficient punching allowance for punching out the front ends of the pole teeth on the inner diameter side of the stator iron core pieces to ensure trouble-free punching even when the gap between the stator and rotor iron core pieces is small, the laminated iron cores having little sheet surface unevenness which is due to pressing and having superior characteristics causing no disturbance in the flow of flux. The method comprises the steps of punching out rotor iron core pieces from a thin metal sheet and laminating them, roughly punching out the pole teeth (7) of the stator iron core pieces from the thin metal sheet from which the rotor pieces have been punched out, thinning the pole teeth (7) by pressing it at a plurality of positions, drawing the material to the punched-out side of the rotor iron core piece so as to form thin regions (10, 11), punching out the front ends (8) of the pole teeth constituting the inner diameter side of the stator iron core pieces, and punching out the outer shape of the stator iron core pieces and laminating them.

公开(公告)号：JP2001274432A

公开(公告)日：2001-10-05

申请号：JP2000084897

申请日：2000-03-24

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE

IPC: H01L29/43 ,  H01L21/28 ,  H01L21/60 ,  H01L31/04 ,  H01L31/10 ,  H01L33/30 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/56 ,  H01S5/02 ,  H01S5/022 ,  H01S5/323 ,  H01L33/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can be easily produced and improved in reliability. SOLUTION: This method is provided with a process for preparing a large number of cells formed with a second conductive semiconductor layer formed on the surface of a spherical substrate, with which a first conductive semiconductor layer is composed of the surface at least, to form a pn bond and an outer electrode composed of a transparent conductive film formed on the surface of the second semiconductor layer; a process for spreading the cells in line all over a tray; a process for charging and hardening conductive materials inside the tray covered with the cells so that the cells can be buried in partial depth; a process for grinding the conductive materials from the side of the rear and exposing the first conductive semiconductor layer so that one part of the conductive materials can be residual as a whole; a process for forming a bump so as to be protruded from the surface of the first conductive semiconductor layer; a process for filling the bump with an insulating resin; and a process for grinding the insulating resin together with the bump, flattering the surface and making this bump into an inner electrode.

公开(公告)号：JP2001210848A

公开(公告)日：2001-08-03

申请号：JP2000019111

申请日：2000-01-27

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE ,  KAI HIDEYOSHI

IPC: H01L31/042

Abstract: PROBLEM TO BE SOLVED: To obtain a solar battery for which the electrode of a spheric semiconductor core section can be formed with high productivity by a new continuous means and the light receiving surface of which can be increased by reducing the shaving amount of the spheric semiconductor of the core section and a method of manufacturing the solar battery by which the solar battery can be manufactured and modularized smoothly. SOLUTION: The solar battery 10 provided with a spheric substrate 1 having a first-conductivity semiconductor carrying a second-conductivity semiconductor on its surface in a core section is constituted in such a way that a through hole 4 is bored through the substrate 1 and an electrode metal 5 is inserted into the hole 4 in a spitting state. Then the metal 5 is bonded to the substrate 1 by forming an alloy layer between the metal 5 and substrate 1 by sintering and a first-conductivity electrode 6 is formed of the protruded part of the metal 5 from the substrate 1.

公开(公告)号：JP2001177122A

公开(公告)日：2001-06-29

申请号：JP35818199

申请日：1999-12-16

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE ,  ISHIDA KEN

IPC: H01L31/04

Abstract: PROBLEM TO BE SOLVED: To enable a solar cell to be enhanced in photoelectromotive force per unit area so as to provide the solar cell which is uniform in characteristics, high in reliability, small in size, and high in efficiency. SOLUTION: This manufacturing method comprises a first process in which a cell is composed of a first conductivity semiconductor spherical substrate, a second conductivity semiconductor layer formed on the spherical substrate to form a pn junction, and an outer electrode transparent conductive film formed on the second semiconductor layer, a large number of cells are prepared; a second process in which the cells are spread in a tray; a third process in which resin is filled into the tray and cured together with the cells spread in the tray to fix a large number of the solar cells in one piece; a fourth process in which the cells fixed with resin and polished in one piece to expose at least a part of the first conductivity semiconductor layer; a fifth process in which a tape is pasted on the cut surfaces of the solar cells; and sixth process in which the resin is removed keeping the solar cells fixed with the tape, and an electrode is formed coming into contact with the first conductivity semiconductor layer.

公开(公告)号：JPH06163778A

公开(公告)日：1994-06-10

申请号：JP33960092

申请日：1992-11-25

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NOUZUMI ATSUO

IPC: H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To enhance the flatness of inner leads by a method wherein a heat treatment process used to remove a residual stress in a working history stored in a lead frame is omitted, the manufacturing process of the lead frame is shortened, the deformation of the inner leads is prevented, the positional accuracy of the inner leads is enhanced and the levitation and fall of the inner leads is eliminated. CONSTITUTION:The title semiconductor device is provided with many leads 12, with a frame-shaped bonding part 14 which connects inner leads 13 collectively and which is composed of an insulating adhesive material and with a heat sink 16 provided with a semiconductor-element mounting part formed in such a way that an outer edge part 16a in which cutout holes 17 have been made at least in individual corner parts has been bent to be a stepped shape by forming a frame-shaped flat part 16b thermocompression-bonded to the bonding part 14 at the outside. In addition, the title semiconductor device is provided with a semiconductor element 15 mounted on the semiconductor-element mounting part, with wires connecting the inner leads 13 to electrodes for the semiconductor element 15 and with a molding body 20 which resin-molds the semiconductor element 15 and its mounting part.

公开(公告)号：JPH06163777A

公开(公告)日：1994-06-10

申请号：JP33806892

申请日：1992-11-24

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NOUZUMI ATSUO

IPC: H01L23/50

Abstract: PURPOSE:To enhance the flatness of inner leads by a method wherein the manufacturing process of the inner leads is shortened, the good heat-dissipating efficiency of the inner leads is obtained, the positional accuracy of the inner leads is enhanced and the levitation and fall of the inner leads is eliminated. CONSTITUTION:The title lead frame is provided with many leads 12, with a frame-shaped bonding part 14 which connects inner leads 13 for the leads 12 collectively and which is composed of an insulating adhesive material and with a heat sink 16 provided with a semiconductor-element mounting part 16d formed in such a way that an outer edge part 16a in which cutout holes have been made at least in individual corner parts has been bent to be a stepped shape by forming a frame-shaped flat part 16b thermocompression-bonded to the bonding part 14 at the outside.

公开(公告)号：JPH0621314A

公开(公告)日：1994-01-28

申请号：JP11632492

申请日：1992-05-08

Applicant: MITSUI HIGH TEC

Inventor： NOUZUMI ATSUO ,  FUKUI ATSUSHI

IPC: H01L23/50

Abstract: PURPOSE:To provide a high-precision lead frame at low cost quickly. CONSTITUTION:A lead frame includes lead frame body, which has a plurality of first inner leads 1 and outer leads 3 formed integrally with the leads 1, a heat sink 7, adhered to the distal ends of the leads 1, and second inner leads 5 formed on the heat sink 7. The first inner leads 1 radially extend from a semiconductor-chip mounting portion 2 at given intervals. The outer leads 3 extend from the respective first inner leads 2. The first inner leads 1 are electrically connected to the associated second inner leads 5.

公开(公告)号：JPH05308113A

公开(公告)日：1993-11-19

申请号：JP2001591

申请日：1991-02-13

Applicant: MITSUI HIGH TEC

Inventor： NOUZUMI ATSUO ,  FUKUI ATSUSHI

IPC: H01L23/50

Abstract: PURPOSE:To use the same metal mold until a cavity region is punched, and improve productivity, by fixing semiconductor element mounting part via a tape for mutually connecting inner leads, after the tip end portions of the inner leads are formed by punching the cavity region. CONSTITUTION:After belt type material 11 is set on a progressive metal mold, and side edges of inner leads 12 and outer leads 13 are formed, the leads are plated with noble metal. The rears of the inner leads are subjected to taping by using a double-sided tape T made of polyimide, and the inner leads are mutually connected. A cavity region is punched so as to be conformed with the chip size, and the lead frame main body is formed. Finally, a heat spreader 15 as a semiconductor device mounting part which is previously punched and formed by using a steel plate is stuck on the rear of the double-sided tape T. Thereby a device can be formed by the same metal mold without depending on the chip size, until the cavity region is punched.

公开(公告)号：JPH0457350A

公开(公告)日：1992-02-25

申请号：JP16927590

申请日：1990-06-27

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NOUZUMI ATSUO ,  DAIMARU HIROFUMI ,  SHIBATA MUNEYA

IPC: H01L23/50

Abstract: PURPOSE:To surely connect conductive plates with a lead frame with high accuracy by laminating and firmly sticking the conductive plates respectively composed at least of one copper foil to the lead frame main body with an insulating layer in between and connecting the plates to at least one lead of the lead frame main body with a conductive bonding agent. CONSTITUTION:Conductive plates 4 respectively composed at least of one copper foil are laminated and firmly stuck to a lead frame main body 5 with an insulating film 11 in between and the copper foil is connected to at least one lead of the main body 5 with a conductive resin. Since the conductive plates 4 respectively composed of the copper foil are connected to at least one lead of the lead frame main body 5 with the conductive resin, this semiconductor device become flexible and is increased in mechanical strength. Therefore, the plates 4 can surely be connected and, at the same time, the inductance can be reduced.

公开(公告)号：JP2002009316A

公开(公告)日：2002-01-11

申请号：JP2000190082

申请日：2000-06-23

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  ISHIDA KEN ,  KIMOTO KEISUKE

IPC: H01L31/04

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-output solar battery that can reliably fix a spherical cell even if it is not a full sphere, prevents an etching agent from leaking, solves the problem of continuity between inner and outer electrodes in high-density packaging, and improves reliability and working efficiency, and to provide the solar battery. SOLUTION: This manufacturing method of a solar battery includes a process for preparing the spherical cell where a second-conductivity-type semiconductor layer is formed so that one portion of a first-conductivity-type semiconductor layer is exposed on the surface of a spherical body substrate having the first-conductivity-type semiconductor layer, a process for forming a conductive substrate having a projecting part on the surface, a process for forming an insulating resin member on the projection, a process for electrically connecting the exposed part of the first-conductivity-type semiconductor layer to the conductive substrate by placing the spherical cell for pressurization so that the exposed part of the first-conductivity-type semiconductor layer of the spherical body cell comes into contact with the insulating resin member, a process that prepares an electrode plate that has an opening mating with the arrangement of the spherical body cell and forms the edge part of the opening in a saw tooth shape, fits the opening to the spherical body cell for fixation, and electrically connects the second-conductivity-type semiconductor layer.