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    POLYIMIDE RESIN COMPOSITION
    13.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：AU579511B2

    公开(公告)日：1988-11-24

    申请号：AU7235687

    申请日：1987-04-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  KOGA NOBUHITO ,  BABA KENICHI

    IPC: C08K7/02 ,  C08L79/08 ,  H01B3/30

    Abstract: New polyimide resin compsn. is composed of 100 pts. by wt. of a polyimide having repeat units represented by general formula (I) and 5 to 100 pts. by wt. of fibrous reinforcing material, where Y represents a direct bond, a divalent 1-10C hydrocarbyl gp., a hexafluoroisopropylidene gp., a carbonyl gp., or a oxido gp. R represents a tetravalent 2 or more C aliphatic gp., an alicyclic gp., a monocyclic aromatic gp., a fused polycyclic aromatic gp., or a non-fused cyclic aromatic gp. in which aromatic gps. are linked direct to each other or via a linking member. The polyimide can have an isopropylidene gp. for Y in general formula (1), it can have a direct bond for Y and (II) for R, it can have an isopropylidene gp. for Y and (III) for R, etc. The fibrous reinforcing material can be glass fibres, carbon fibres, potassium titanate fibres or aromatic polyamide fibres.

    POLYAMINOBISMALEIMIDE PRECURSOR RESIN
    14.
    发明专利
    POLYAMINOBISMALEIMIDE PRECURSOR RESIN 未知

    公开(公告)号：AU7552387A

    公开(公告)日：1988-01-21

    申请号：AU7552387

    申请日：1987-07-10

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA

    IPC: C08G73/12 ,  C08G73/10 ,  C08G73/14

    Abstract: 1. A thermosetting resin composition which comprises a bismaleimide derivative having the formula (I): and a diamine derivative having the formula (II): wherein R is a divalent radical represented by or where X is selected from a bond, a divalent hydrocarbon radical having 2 carbon atoms, hexafluorinated isopropylidene radical, carbonyl radical, thio radical and sulfinyl radical. A thermosetting resin prepolymer may be obtained by conducting heat-treatment of the thermosetting resin composition at a temperature of 70 to 220 DEG C in the presence or absence of a solvent.

    THERMOSETTING RESIN FORMING COMPOSITION AND PROCESS FOR PREPARING SAME
    15.
    发明专利
    THERMOSETTING RESIN FORMING COMPOSITION AND PROCESS FOR PREPARING SAME 未知

    公开(公告)号：CA2028312C

    公开(公告)日：1996-03-12

    申请号：CA2028312

    申请日：1990-10-23

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/12

    Abstract: Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): (I) wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): (II) wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, and O-, or by formula (III)): (III) wherein n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.

    16.
    发明专利
    未知

    公开(公告)号：DE68915407T2

    公开(公告)日：1994-12-01

    申请号：DE68915407

    申请日：1989-11-27

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08F212/34 ,  C08F12/00 ,  C08F20/10 ,  C08F22/36 ,  C08F222/40 ,  C08G73/12

    Abstract: This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: wherein R represents a divalent group of or X being a direct bond or a group selected from divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.

    17.
    发明专利
    未知

    公开(公告)号：DE3883134T2

    公开(公告)日：1994-04-14

    申请号：DE3883134

    申请日：1988-10-06

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAGUCHI KEIZABURO ,  TANABE YOSHIMITSU ,  URAKAMI TATSUHIRO ,  YAMAGUCHI AKIHIRO ,  YAMAYA NORIMASA ,  OHTA MASAHIRO

    IPC: C07C211/50 ,  C08G73/10 ,  C08G73/12 ,  C08L79/04 ,  C08G73/02

    Abstract: Disclosed herein is an aromatic amine resin formed of a mixture of aromatic amine compounds represented by the following general formula (a): wherein A means a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R denotes a halogen atom or a hydroxyl, C1-4 alkoxy or C1-5 alkyl group, l stands for 1 or 2, m is an integer of 0-3, when m is 2 or 3, R s may be the same or different and two of R s may join together into a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and n stands for an integer of 0-300.

    19.
    发明专利
    未知

    公开(公告)号：DE68908009D1

    公开(公告)日：1993-09-09

    申请号：DE68908009

    申请日：1989-05-17

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/12

    Abstract: The present invention relates to thermosetting resin compositions comprising a bismaleimide compound represented by the formula (I) and an aromatic amine resin represented by the general formula (II) and to processes for preparing the same. g

    20.
    发明专利
    未知

    公开(公告)号：DE3784842D1

    公开(公告)日：1993-04-22

    申请号：DE3784842

    申请日：1987-04-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  KOGA NOBUHITO ,  BABA KENICHI

    IPC: C08K7/02 ,  C08L79/08 ,  H01B3/30

    Abstract: New polyimide resin compsn. is composed of 100 pts. by wt. of a polyimide having repeat units represented by general formula (I) and 5 to 100 pts. by wt. of fibrous reinforcing material, where Y represents a direct bond, a divalent 1-10C hydrocarbyl gp., a hexafluoroisopropylidene gp., a carbonyl gp., or a oxido gp. R represents a tetravalent 2 or more C aliphatic gp., an alicyclic gp., a monocyclic aromatic gp., a fused polycyclic aromatic gp., or a non-fused cyclic aromatic gp. in which aromatic gps. are linked direct to each other or via a linking member. The polyimide can have an isopropylidene gp. for Y in general formula (1), it can have a direct bond for Y and (II) for R, it can have an isopropylidene gp. for Y and (III) for R, etc. The fibrous reinforcing material can be glass fibres, carbon fibres, potassium titanate fibres or aromatic polyamide fibres.

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