-
公开(公告)号：CA1333947C
公开(公告)日：1995-01-10
申请号：CA599626
申请日：1989-05-15
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: The present invention relates to thermosetting resin compositions comprising a bismaleimide compound represented by the formula (I) (I) and an aromatic amine resin represented by the general formula (II) (II) and to processes for preparing the same.
-
公开(公告)号：DE68915407D1
公开(公告)日：1994-06-23
申请号：DE68915407
申请日：1989-11-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08F212/34 , C08F12/00 , C08F20/10 , C08F22/36 , C08F222/40 , C08G73/12
Abstract: This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: wherein R represents a divalent group of or X being a direct bond or a group selected from divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.
-
公开(公告)号：CA1326319C
公开(公告)日：1994-01-18
申请号：CA565597
申请日：1988-04-29
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is prepared from a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components, e.g., as a sealing material in sockets and connectors and for other applications.
-
公开(公告)号：DE3876129T2
公开(公告)日：1993-06-17
申请号：DE3876129
申请日：1988-04-20
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound I and a diamine compound II, and a fibrous reinforcing material selected from potassium titante fibres and aromatic polyamide fibres, the fibres having an aspect ratio of from 5 to 600. The composition has excellent impact resistance and toughness while retaining conventional high heat resistance.
-
公开(公告)号：DE3874224T2
公开(公告)日：1993-04-01
申请号：DE3874224
申请日：1988-04-29
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.
-
Patent Agency Ranking6.发明专利
公开(公告)号：CA2192394A1
公开(公告)日：1991-04-25
申请号：CA2192394
申请日：1990-10-23
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C07D207/452 , C08G73/12 , C08L79/08
-
7.发明专利
公开(公告)号：CA2192394C
公开(公告)日：2000-08-15
申请号：CA2192394
申请日：1990-10-23
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C07D207/452 , C08G73/12 , C08L79/08
Abstract: Disclosed is a resin forming composition comprising ( i ) an aromatic diamine compound represented by the formula (I) (I) (wherein R is H or CH3) and (ii) a bismaleimide compound represented by the formula (IV) (IV) (wherein R is H or CH3) . A resin obtained from the composition may be used as a coating film, adhesive layer or molded article.
-
公开(公告)号：DE69015158T2
公开(公告)日：1995-08-03
申请号：DE69015158
申请日：1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like. The diamine is of formula The maleimide is the bismaleimide or the polymaleimide
-
公开(公告)号：DE3781843D1
公开(公告)日：1992-10-29
申请号：DE3781843
申请日：1987-07-10
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , KOGA NOBUHITO , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: 1. A thermosetting resin composition which comprises a bismaleimide derivative having the formula (I): and a diamine derivative having the formula (II): wherein R is a divalent radical represented by or where X is selected from a bond, a divalent hydrocarbon radical having 2 carbon atoms, hexafluorinated isopropylidene radical, carbonyl radical, thio radical and sulfinyl radical. A thermosetting resin prepolymer may be obtained by conducting heat-treatment of the thermosetting resin composition at a temperature of 70 to 220 DEG C in the presence or absence of a solvent.
-
公开(公告)号：DE3874223D1
公开(公告)日：1992-10-08
申请号：DE3874223
申请日：1988-04-29
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.
-
-
-
-
-
-
-
-
-
Search Results
58
records
(took 0.023 seconds)
