SILICON SUBSTRATES WITH DOPED SURFACE CONTACTS FORMED FROM DOPED SILICON INKS AND CORRESPONDING PROCESSES
    13.
    发明申请
    SILICON SUBSTRATES WITH DOPED SURFACE CONTACTS FORMED FROM DOPED SILICON INKS AND CORRESPONDING PROCESSES 审中-公开
    具有由掺杂硅油和相应工艺形成的掺杂表面的硅基材

    公开(公告)号:WO2012106137A2

    公开(公告)日:2012-08-09

    申请号:PCT/US2012/022215

    申请日:2012-01-23

    Abstract: The use of doped silicon nanoparticle inks and other liquid dopant sources can provide suitable dopant sources for driving dopant elements into a crystalline silicon substrate using a thermal process if a suitable cap is provided. Suitable caps include, for example, a capping slab, a cover that may or may not rest on the surface of the substrate and a cover layer. Desirable dopant profiled can be achieved. The doped nanoparticles can be delivered using a silicon ink. The residual silicon ink can be removed after the dopant drive-in or at least partially densified into a silicon material that is incorporated into the product device. The silicon doping is suitable for the introduction of dopants into crystalline silicon for the formation of solar cells.

    Abstract translation: 使用掺杂的硅纳米颗粒油墨和其它液体掺杂剂源可以提供合适的掺杂剂源,以便如果提供合适的盖,则使用热处理将掺杂剂元素驱动到晶体硅衬底中。 合适的帽包括例如盖板,可以或可以不搁置在基材表​​面上的盖和覆盖层。 可以实现期望的掺杂剂。 可以使用硅油墨递送掺杂的纳米颗粒。 在掺杂剂驱入或至少部分致密化成掺入产品装置的硅材料之后,可以除去残留的硅油墨。 硅掺杂适用于将掺杂剂引入结晶硅以形成太阳能电池。

    PHOTOVOLTAIC STRUCTURES PRODUCED WITH SILICON RIBBONS
    15.
    发明申请
    PHOTOVOLTAIC STRUCTURES PRODUCED WITH SILICON RIBBONS 审中-公开
    用硅胶生产的光伏结构

    公开(公告)号:WO2011062975A2

    公开(公告)日:2011-05-26

    申请号:PCT/US2010/057011

    申请日:2010-11-17

    Abstract: Photovoltaic elements can be formed by in-motion processing of a silicon ribbon. In some embodiments, only a single surface of a silicon ribbon is processed in-motion. In other embodiments both surfaces of a silicon ribbon is processed in-motion. In-motion processing can include, but is not limited to, formation of patterned or uniform doped regions within or along the silicon ribbon as well as the formation of patterned or uniform dielectric layers and/or electrically conductive elements on the silicon ribbon. After performing in-motion processing, additional processing steps can be performed after the ribbon is cut into portions. Furthermore, post-cut processing can include, but is not limited to, the formation of solar cells, photovoltaic modules, and solar panels.

    Abstract translation: 可以通过硅带的运动内处理来形成光伏元件。 在一些实施例中,只有硅带的单个表面被运动地处理。 在其它实施例中,硅带的两个表面被运动地处理。 运动内处理可以包括但不限于在硅带内或沿着硅带形成图案化或均匀的掺杂区,以及在硅带上形成图案化或均匀的介电层和/或导电元件。 在执行运动处理之后,可以在色带被切割成部分之后执行附加的处理步骤。 此外,后切割处理可以包括但不限于形成太阳能电池,光伏模块和太阳能电池板。

    FUNCTIONAL COMPOSITES, FUNCTIONAL INKS AND APPLICATIONS THEREOF
    16.
    发明申请
    FUNCTIONAL COMPOSITES, FUNCTIONAL INKS AND APPLICATIONS THEREOF 审中-公开
    功能复合材料,功能性油墨及其应用

    公开(公告)号:WO2008100568A1

    公开(公告)日:2008-08-21

    申请号:PCT/US2008/001954

    申请日:2008-02-14

    Abstract: Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.

    Abstract translation: 功能复合材料包括有机基质内的元素无机颗粒。 元素无机材料通常包含元素金属,元素准金属,其合金或其混合物。 在替代或另外的实施方案中,无机颗粒可以包含金属氧化物,类金属氧化物,其组合或其混合物。 当与有机基质共混不超过约2微米时,无机颗粒的平均一次粒径不超过250nm,分散体中的二次粒径。 颗粒可以在复合材料内基本上未聚集。 有机粘合剂可以是功能聚合物,例如半导体聚合物。 无机颗粒可以被表面改性,例如具有芳族官能团的部分用于与半导体聚合物的期望相互作用。 基于溶液的方法可用于从颗粒的分散体形成复合物。 复合材料可以加工成产品,如印刷电子设备。

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