公开(公告)号：US20140133168A1

公开(公告)日：2014-05-15

申请号：US14074875

申请日：2013-11-08

Applicant: OSRAM GMBH

Inventor： Roland Fiederling ,  Philipp Helbig ,  Thomas Feil

IPC: F21K99/00 ,  F21S8/10

CPC classification number: F21S48/1241 ,  F21S41/143 ,  F21S41/24 ,  F21S41/663

Abstract: A lighting device may include: a plurality of light sources; and a plurality of waveguides; wherein the waveguides each have a light coupling-in surface and a light coupling-out surface; wherein the light coupling-in surfaces are respectively assigned a light-emitting surface of a light source, such that light emitted by the light-emitting surface of the light source impinges on the light coupling-in surface of the waveguide assigned thereto; wherein the light coupling-out surfaces of the waveguides are arranged in a matrix-like manner; wherein the light coupling-in surface of the respective waveguide is smaller than the light-emitting surface of the light source assigned to said waveguide, and a grating-like optical diaphragm having grating cells is provided, which is arranged in the region of the light coupling-in surfaces of the waveguides, such that light coupling-in surfaces belonging to different waveguides are arranged in different grating cells of the grating-like optical diaphragm.

Abstract translation: 照明装置可以包括：多个光源; 和多个波导; 其中所述波导各自具有光耦合入表面和光耦合表面; 其中光耦合入的表面分别被指定为光源的发光表面，使得由光源的发光表面发射的光照射到分配给其的波导的光耦合表面; 其中所述波导的所述光耦合出表面以矩阵状的方式布置; 其中各波导管的光耦合表面小于分配给所述波导的光源的发光表面，并且设置有光栅单元的格栅状光学膜，该光栅被布置在光的区域中 波导的耦合表面，使得属于不同波导的光耦合入表面被布置在格栅状光学膜片的不同光栅单元中。

公开(公告)号：US10383209B2

公开(公告)日：2019-08-13

申请号：US15987950

申请日：2018-05-24

Applicant: Osram GmbH

Inventor： Philipp Helbig ,  Sebastian Jooss

IPC: H05K1/00 ,  H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K3/34 ,  H05K1/14 ,  F21V29/70 ,  H05K3/00 ,  H01L25/075 ,  F21Y115/10 ,  H05K1/11 ,  H01L33/62 ,  H05K1/18 ,  H01L33/64

Abstract: An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

公开(公告)号：US20190063708A1

公开(公告)日：2019-02-28

申请号：US16106004

申请日：2018-08-21

Applicant: OSRAM GmbH

Inventor： Joachim Stoehr ,  Philipp Helbig ,  Stephan Schwaiger

IPC: F21S41/24 ,  F21S41/19 ,  F21S41/151

CPC classification number: F21S41/24 ,  F21S41/151 ,  F21S41/192 ,  F21S41/29 ,  F21S41/663 ,  F21Y2115/10 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/10522 ,  H05K2201/2036 ,  H05K2203/167

Abstract: A lighting system includes an optical unit. The optical unit includes at least one light guide, which is provided for at least one light source. The lighting system further includes a retaining frame for the optical unit, via which frame the optical unit is fastened to a printed circuit board including the at least one light source, and a spacer for positioning the optical unit, which spacer is arranged between the retaining frame and the printed circuit board, the spacer having at least one continuous bearing opening in order to receive the at least one light guide. At least one guide recess is formed on the edge of the at least one bearing opening and at least one support face is provided on the edge, on which support face the light guide introduced into the bearing opening can be supported.

公开(公告)号：US20180343735A1

公开(公告)日：2018-11-29

申请号：US15987950

申请日：2018-05-24

Applicant: Osram GmbH

Inventor： Philipp Helbig ,  Sebastian Jooss

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  F21V29/70 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0201 ,  F21V29/70 ,  F21Y2115/10 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K1/0265 ,  H05K1/111 ,  H05K1/145 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/341 ,  H01L2924/00014

Abstract: An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

公开(公告)号：US09970622B2

公开(公告)日：2018-05-15

申请号：US15001307

申请日：2016-01-20

Applicant: OSRAM GmbH

Inventor： Philipp Helbig ,  Peter Frey ,  Peter Helbig ,  Thomas Feil

IPC: F21S41/19 ,  F21S41/141 ,  F21S45/47 ,  F21S8/10

CPC classification number: F21S45/47 ,  F21S43/14 ,  F21S43/195

Abstract: A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.

公开(公告)号：US20170097132A1

公开(公告)日：2017-04-06

申请号：US15315759

申请日：2015-05-13

Applicant: OSRAM GmbH

Inventor： Juergen Hager ,  Philipp Helbig ,  Stephan Schwaiger ,  Jasmin Muster

IPC: F21S8/10 ,  B60Q1/00 ,  B60Q1/14

CPC classification number: F21S41/635 ,  B60Q1/0088 ,  B60Q1/14 ,  B60Q2300/40 ,  F21S41/141 ,  F21S41/17 ,  F21V14/06 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: Various embodiments may relate to an illumination device for vehicles, including multiple semiconductor light sources, and at least one light wavelength conversion element for the wavelength conversion of the light emitted by the semiconductor sources. At least one light-refracting optical unit is associated with each semiconductor source, which is designed to direct light emitted by the respective semiconductor source onto the at least one light wavelength conversion element. The at least one light-refracting optical unit is movably arranged with respect to the semiconductor source with which it is associated.

公开(公告)号：US20150077988A1

公开(公告)日：2015-03-19

申请号：US14390042

申请日：2013-04-12

Applicant: OSRAM GmbH

Inventor： Philipp Helbig ,  Stephan Schwaiger

IPC: F21V19/00 ,  F21V17/16

CPC classification number: F21V19/004 ,  F21V17/12 ,  F21V17/16 ,  F21V19/0035 ,  F21V19/005 ,  F21V19/0055 ,  F21V29/89 ,  F21Y2115/10

Abstract: Various embodiments may relate to an illumination device including at least one semiconductor light source arrangement that is fixed to a carrier. The at least one semiconductor light source arrangement is fixed to the carrier at multiple locations by means of a press fit.

Abstract translation: 各种实施例可以涉及包括固定到载体的至少一个半导体光源装置的照明装置。 所述至少一个半导体光源装置通过压配合在多个位置固定到所述载体上。

公开(公告)号：US20140376232A1

公开(公告)日：2014-12-25

申请号：US14376903

申请日：2013-02-13

Applicant: OSRAM GmbH

Inventor： Gerhard Behr ,  Stephan Schwaiger ,  Philipp Helbig

IPC: F21V19/00 ,  F21K99/00 ,  F21V29/00 ,  F21V17/16 ,  F21V17/12

CPC classification number: F21V19/002 ,  F21K9/60 ,  F21S41/147 ,  F21S41/19 ,  F21S41/39 ,  F21S45/47 ,  F21V7/06 ,  F21V17/02 ,  F21V17/12 ,  F21V17/16 ,  F21V17/164 ,  F21V19/0035 ,  F21V19/0055 ,  F21V19/045 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: A lighting device may include a semiconductor light source module, an optical unit, and a common support for the semiconductor light source module and the optical unit. The optical unit is mounted on a front side of the support and has at least one dowel, which extends into a precisely fitting hole in the semiconductor light source module. The semiconductor light source module rests on a rear side of the support. The at least one dowel projects through an aperture in the support and extends into the precisely fitting hole in the semiconductor light source module. The at least one dowel forms a shoulder, which rests on a supporting surface of the semiconductor light source module that rests on the rear side of the support.

Abstract translation: 照明装置可以包括半导体光源模块，光学单元和用于半导体光源模块和光学单元的公共支撑。 光学单元安装在支撑件的前侧，并且具有至少一个销钉，其延伸到半导体光源模块中的精确配合的孔中。 半导体光源模块位于支架的后侧。 所述至少一个定位销通过所述支撑件中的孔突出并延伸到所述半导体光源模块中的精确配合的孔中。 所述至少一个销钉形成肩部，所述肩部位于所述半导体光源模块的支撑在支撑体后侧的支撑表面上。