公开(公告)号：US20230059982A1

公开(公告)日：2023-02-23

申请号：US17759348

申请日：2021-01-20

Applicant: OSRAM GmbH

Inventor： Michael Beck ,  Sebastian Jooss ,  Gerhard Behr

IPC: H05K1/18

Abstract: Please replace the Abstract with the following: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

公开(公告)号：US09297522B2

公开(公告)日：2016-03-29

申请号：US14376903

申请日：2013-02-13

Applicant: OSRAM GmbH

Inventor： Gerhard Behr ,  Stephan Schwaiger ,  Philipp Helbig

IPC: F21V19/00 ,  F21S8/10 ,  F21V7/06 ,  F21V17/02 ,  F21V17/16 ,  F21V19/04 ,  F21K99/00 ,  F21V17/12 ,  F21V29/70 ,  F21V29/76 ,  F21Y101/02

CPC classification number: F21V19/002 ,  F21K9/60 ,  F21S41/147 ,  F21S41/19 ,  F21S41/39 ,  F21S45/47 ,  F21V7/06 ,  F21V17/02 ,  F21V17/12 ,  F21V17/16 ,  F21V17/164 ,  F21V19/0035 ,  F21V19/0055 ,  F21V19/045 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: A lighting device may include a semiconductor light source module, an optical unit, and a common support for the semiconductor light source module and the optical unit. The optical unit is mounted on a front side of the support and has at least one dowel, which extends into a precisely fitting hole in the semiconductor light source module. The semiconductor light source module rests on a rear side of the support. The at least one dowel projects through an aperture in the support and extends into the precisely fitting hole in the semiconductor light source module. The at least one dowel forms a shoulder, which rests on a supporting surface of the semiconductor light source module that rests on the rear side of the support.

Abstract translation: 照明装置可以包括半导体光源模块，光学单元和用于半导体光源模块和光学单元的公共支撑。 光学单元安装在支撑件的前侧，并且具有至少一个销钉，其延伸到半导体光源模块中的精确配合的孔中。 半导体光源模块位于支架的后侧。 所述至少一个定位销通过所述支撑件中的孔突出并延伸到所述半导体光源模块中的精确配合的孔中。 所述至少一个销钉形成肩部，所述肩部位于所述半导体光源模块的支撑在支撑体后侧的支撑表面上。

公开(公告)号：US20140376232A1

公开(公告)日：2014-12-25

申请号：US14376903

申请日：2013-02-13

Applicant: OSRAM GmbH

Inventor： Gerhard Behr ,  Stephan Schwaiger ,  Philipp Helbig

IPC: F21V19/00 ,  F21K99/00 ,  F21V29/00 ,  F21V17/16 ,  F21V17/12

CPC classification number: F21V19/002 ,  F21K9/60 ,  F21S41/147 ,  F21S41/19 ,  F21S41/39 ,  F21S45/47 ,  F21V7/06 ,  F21V17/02 ,  F21V17/12 ,  F21V17/16 ,  F21V17/164 ,  F21V19/0035 ,  F21V19/0055 ,  F21V19/045 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: A lighting device may include a semiconductor light source module, an optical unit, and a common support for the semiconductor light source module and the optical unit. The optical unit is mounted on a front side of the support and has at least one dowel, which extends into a precisely fitting hole in the semiconductor light source module. The semiconductor light source module rests on a rear side of the support. The at least one dowel projects through an aperture in the support and extends into the precisely fitting hole in the semiconductor light source module. The at least one dowel forms a shoulder, which rests on a supporting surface of the semiconductor light source module that rests on the rear side of the support.

Abstract translation: 照明装置可以包括半导体光源模块，光学单元和用于半导体光源模块和光学单元的公共支撑。 光学单元安装在支撑件的前侧，并且具有至少一个销钉，其延伸到半导体光源模块中的精确配合的孔中。 半导体光源模块位于支架的后侧。 所述至少一个定位销通过所述支撑件中的孔突出并延伸到所述半导体光源模块中的精确配合的孔中。 所述至少一个销钉形成肩部，所述肩部位于所述半导体光源模块的支撑在支撑体后侧的支撑表面上。

公开(公告)号：US11716815B2

公开(公告)日：2023-08-01

申请号：US17759348

申请日：2021-01-20

Applicant: OSRAM GmbH

Inventor： Michael Beck ,  Sebastian Jooss ,  Gerhard Behr

IPC: H05K1/00 ,  H05K1/18

CPC classification number: H05K1/184 ,  H05K2201/10106

Abstract: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.