公开(公告)号：US20200116829A1

公开(公告)日：2020-04-16

申请号：US16483037

申请日：2018-01-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dirk Becker ,  Martin Haushalter ,  Claus Jaeger

IPC: G01S7/481 ,  G01V8/14

Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

公开(公告)号：US20180254605A1

公开(公告)日：2018-09-06

申请号：US15754333

申请日：2016-08-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Wojcik ,  Martin Haushalter

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/00

Abstract: A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.

公开(公告)号：US20180076370A1

公开(公告)日：2018-03-15

申请号：US15565239

申请日：2016-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  Frank Singer ,  Thomas Schwarz ,  Andreas Ploessl

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/642 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

公开(公告)号：US09673365B2

公开(公告)日：2017-06-06

申请号：US14771850

申请日：2014-03-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  David O'Brien

IPC: H01L33/62 ,  H01L33/48 ,  H05K1/18 ,  H05K3/34 ,  F21K9/20 ,  H05K1/14

CPC classification number: H01L33/62 ,  F21K9/20 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09954 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.

公开(公告)号：US09318678B2

公开(公告)日：2016-04-19

申请号：US14653835

申请日：2013-12-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Wojcik ,  Martin Haushalter ,  Frank Möllmer ,  Wilhelm Karsten ,  Heinz Haas

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54 ,  H01L33/60 ,  H01L23/495 ,  H01L51/52 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L23/49548 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L51/5203 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.

Abstract translation: 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。