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公开(公告)号：US20150097198A1
公开(公告)日：2015-04-09
申请号：US14385116
申请日：2013-02-20
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Matthias Sabathil , Alexander Linkov , Thomas Bleicher , Norwin von Malm , Wolfgang Mönch
CPC classification number: H01L33/58 , F21Y2101/00 , F21Y2105/00 , F21Y2115/10 , G02B6/0015 , G02B6/0018 , G02B6/0025 , G02F1/133603 , G02F1/133605 , G02F1/133606 , G02F1/133611 , G02F1/133615 , G02F2001/133607 , H01L25/0753 , H01L33/44 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/644 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip.
Abstract translation: 在至少一个实施例中，表面光源包括具有用于产生主辐射的辐射主侧的一个或多个光电子半导体芯片。 散射体沿着半导体芯片的主发射方向设置在辐射主侧的下游。 散粒体设计用于散射初级辐射。 散射体的主发射方向相对于半导体芯片的主发射方向倾斜取向。
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公开(公告)号：US20150048400A1
公开(公告)日：2015-02-19
申请号：US14383177
申请日：2013-02-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Britta Göötz , Jürgen Moosburger , Andreas Plössl , Matthias Sabathil
CPC classification number: H01L33/641 , C23C24/04 , C25D7/12 , H01L33/0079 , H01L33/46 , H01L33/644 , H01L2924/0002 , H01L2933/0025 , H01L2933/005 , H01L2933/0075 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor chip includes growing an optoelectronic semiconductor layer sequence on a growth substrate, forming an electrically insulating layer on a side of the optoelectronic semiconductor layer sequence facing away from the growth substrate by depositing particles of an electrically insulating material by an aerosol deposition method, and at least partly removing the growth substrate after forming the electrically insulating layer.
Abstract translation: 制造光电子半导体芯片的方法包括在生长衬底上生长光电子半导体层序列，通过将电绝缘材料的颗粒沉积在光电子半导体层序列的一侧上而形成电光绝缘层 气溶胶沉积法，并且在形成电绝缘层之后至少部分去除生长衬底。
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13.发明授权公开(公告)号：US11101249B2
公开(公告)日：2021-08-24
申请号：US16322069
申请日：2017-08-01
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Thomas Schwarz , Lutz Hoeppel , Matthias Sabathil
IPC: H01L25/075 , H01L33/62 , H01L33/56 , H01L33/58 , H01L33/54
Abstract: In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.
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14.发明申请公开(公告)号：US20190123238A1
公开(公告)日：2019-04-25
申请号：US16090635
申请日：2017-04-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Matthias Sabathil , Frank Singer
Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
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公开(公告)号：US09876155B2
公开(公告)日：2018-01-23
申请号：US15524114
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Matthias Sabathil , Matthias Sperl , Björn Hoxhold
CPC classification number: H01L33/62 , H01L25/167 , H01L33/005 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.
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Patent Agency Ranking
公开(公告)号：US20160181491A1
公开(公告)日：2016-06-23
申请号：US15058667
申请日：2016-03-02
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
CPC classification number: H01L33/60 , H01L25/0753 , H01L25/167 , H01L25/50 , H01L31/00 , H01L31/02322 , H01L33/46 , H01L33/486 , H01L33/54 , H01L33/56 , H01L51/5271 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
Abstract: An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.
Abstract translation: 一种包括具有第一表面的光电子半导体芯片的光电半导体部件，其中所述第一表面是所述光电子半导体芯片的辐射发射表面，所述半导体芯片被嵌入在模体中，所述第一表面相对于顶侧被升高 并且反射层设置在模体的顶侧。
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17.发明申请公开(公告)号：US20160056344A1
公开(公告)日：2016-02-25
申请号：US14779818
申请日：2014-03-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Joachim Reill , Frank Singer , Norwin von Malm , Matthias Sabathil
CPC classification number: H01L33/486 , H01L23/49805 , H01L33/005 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.
Abstract translation: 光电半导体元件包括半导体芯片，半导体芯片具有包括产生辐射的有源区的半导体层序列; 辐射出口表面平行于有源区域延伸; 安装侧表面，其固定所述半导体部件并且倾斜地或垂直于所述辐射出射表面延伸，并且至少一个用于外部电接触的接触区域可接近; 在半导体芯片上成型的成型体，至少在区域形成安装侧面; 以及布置在所述模制体上并将所述半导体芯片导电连接到所述至少一个接触区域的接触轨道。
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公开(公告)号：US20150346397A1
公开(公告)日：2015-12-03
申请号：US14430202
申请日：2013-09-13
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Alexander Linkov , Matthias Sabathil
CPC classification number: G02B5/0294 , G02B5/0242 , G02B5/0247 , G02B5/0263 , G02B5/0278 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/56 , H01L33/58 , H01L2933/0091
Abstract: The invention relates to an optoelectronic device (101), comprising: —a semiconductor layer sequence (103) comprising an emitter layer (105) for emitting electromagnetic radiation, —a converter (113) for converting electromagnetic radiation with a first wavelength into an electromagnetic radiation with a second wavelength which differs from the first wavelength, —a scattering body (109) for scattering at least a part of the electromagnetic radiation emitted by the emitter layer (105) in the direction of the converter (113) in order to convert at least a part of the emitted electromagnetic radiation, wherein the scattering body (109) comprises a positive, temperature-dependent scattering cross-section and so, as the temperature increases, scattering of the electromagnetic radiation in the scattering body (109) in the direction of the converter can be increased. The invention also relates to a scattering body (109).
Abstract translation: 本发明涉及一种光电器件（101），包括： - 半导体层序列（103），包括用于发射电磁辐射的发射极层（105）， - 转换器（113），用于将具有第一波长的电磁辐射转换成电磁 具有不同于第一波长的第二波长的辐射， - 散射体（109），用于将由发射极层（105）发射的电磁辐射的至少一部分沿着转换器（113）的方向散射，以便转换 至少一部分发射的电磁辐射，其中散射体（109）包括正的温度依赖的散射截面，因此随着温度的升高，电磁辐射在散射体（109）中的散射在 可以提高转换器的方向。 本发明还涉及散射体（109）。
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公开(公告)号：US20150243857A1
公开(公告)日：2015-08-27
申请号：US14424796
申请日：2013-08-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz , Walter Wegleiter
CPC classification number: H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
Abstract translation: 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
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20.发明申请OPTOELECTRONIC SEMICONDUCTOR COMPONENT HAVING AN ELECTRICALLY INSULATING ELEMENT 有权具有电绝缘元件的光电子半导体元件公开(公告)号：US20150235919A1
公开(公告)日：2015-08-20
申请号：US14413748
申请日：2013-07-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
IPC: H01L23/373 , H01L31/024 , H01L33/64
CPC classification number: H01L23/3731 , H01L31/024 , H01L33/56 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48464 , H01L2924/181 , H01L2933/0075 , H01L2924/00014 , H01L2924/00012
Abstract: Disclosed is a non-transitory computer-readable storage medium that stores a game program that processes progress of a game using a plurality of game mediums, the game program causing a computer to execute: moving each of the game mediums along a predetermined path in a game field including a plurality of regions; first displaying a selection object capable of selecting at least one of the plurality of regions so that the selection object is fired according to an operation detected by a predetermined input unit; and changing, when one of the plurality of regions is selected by the selection object, an attribute set in the region to change the predetermined path where the game medium moves.
Abstract translation: 公开了一种非暂时性计算机可读存储介质，其存储使用多个游戏介质处理游戏进程的游戏程序，所述游戏程序使得计算机执行：沿着预定路径移动每个游戏介质 游戏场包括多个区域; 首先显示能够选择多个区域中的至少一个的选择对象，使得根据由预定输入单元检测到的操作来触发选择对象; 以及当所述选择对象选择所述多个区域中的一个区域时，改变所述区域中设置的属性，以改变所述游戏介质移动的预定路径。
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