公开(公告)号：AU2398195A

公开(公告)日：1995-11-29

申请号：AU2398195

申请日：1995-05-02

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M ,  CRUZ EDWARD V ,  RAZO VINCENT R ,  FYNN SHAUN

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20

Abstract: A computer system including a plurality of air circulation areas to facilitate cooling of components with in the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply, and for a plurality of internal and external peripherals, such as disk drives. The system also includes an automatic door that covers the external peripherals. The external peripherals slide forward, out of a casing of the system to facilitate upgrade and/or repair of the peripherals. In addition, the system includes cabling slots and structure to effect electromagnetic interference (EMI) shielding.

公开(公告)号：AU2115795A

公开(公告)日：1995-09-25

申请号：AU2115795

申请日：1995-03-09

Applicant: PANDA PROJECT THE

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

IPC: H01L23/50 ,  H01L21/44 ,  H01L23/057 ,  H01L23/48 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

公开(公告)号：DE69509878D1

公开(公告)日：1999-07-01

申请号：DE69509878

申请日：1995-03-09

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

IPC: H01R33/76 ,  H01L23/12 ,  H01L23/32 ,  H01R12/50 ,  H01R13/26 ,  H05K3/34 ,  H05K7/10 ,  H01R23/68

公开(公告)号：AU6156996A

公开(公告)日：1996-12-30

申请号：AU6156996

申请日：1996-06-05

Applicant: PANDA PROJECT

Inventor： MOSLEY JOSEPH M ,  PORTUONDO MARIA M

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L23/66 ,  H05K3/34