公开(公告)号：AU6156996A

公开(公告)日：1996-12-30

申请号：AU6156996

申请日：1996-06-05

Applicant: PANDA PROJECT

Inventor： MOSLEY JOSEPH M ,  PORTUONDO MARIA M

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L23/66 ,  H05K3/34

公开(公告)号：AU6091596A

公开(公告)日：1996-12-30

申请号：AU6091596

申请日：1996-06-04

Applicant: PANDA PROJECT THE

Inventor： MOSLEY JOSEPH M ,  PORTUONDO MARIA M ,  TAYLOR DREW L

IPC: H01L23/50 ,  H01L23/057 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34 ,  H01L23/495

Abstract: A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

公开(公告)号：AU5989096A

公开(公告)日：1996-12-30

申请号：AU5989096

申请日：1996-06-04

Applicant: PANDA PROJECT

Inventor： MOSLEY JOSEPH M ,  PORTUONDO MARIA M

IPC: H01L25/065