公开(公告)号：EP0428165A1

公开(公告)日：1991-05-22

申请号：EP90121829.7

申请日：1990-11-14

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

Abstract translation: 导电水泥其中当用于粘合导电的配合表面提供高湿度条件下是基本上稳定的传导特性; 由载体的没有提供的大于约6.8％的体积收缩率（体积）和导电填料包括团聚颗粒，粉末，薄片，涂覆镍颗粒和涂覆的玻璃球，具有尺寸和表面特征做了保持稳定的电 通过形成具有在电气元件引线的耐潮接触。 具有大于约6.8％（体积）的未固化和固化状态之间的体积收缩的载体显示，以实现使颗粒填料粒子的压实被迫进入增强与所述表面电接触以连接，并提供一种 颗粒本身之间压实措施，以提高颗粒与颗粒的传导。 聚合物载体的压缩下固化场所内部的颗粒用足够的力时的收缩以促使颗粒进入彼此接合以及使颗粒穿透非导电氧化物也可存在于元件引线。