公开(公告)号：EP0402546B1

公开(公告)日：1996-09-04

申请号：EP89306621.7

申请日：1989-06-29

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David

IPC: H05K3/12 ,  H05K1/09 ,  H01B1/22 ,  C09D11/00 ,  C09D11/10

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

公开(公告)号：EP1246206A3

公开(公告)日：2004-04-14

申请号：EP02012317.0

申请日：1990-11-14

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

IPC: H01B1/22 ,  C09J163/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

公开(公告)号：EP0428165B1

公开(公告)日：2002-11-20

申请号：EP90121829.7

申请日：1990-11-14

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

公开(公告)号：EP0641153A1

公开(公告)日：1995-03-01

申请号：EP94306220.8

申请日：1994-08-23

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Iannetta, Roger A., Jr.

IPC: H05K3/10 ,  H05K3/32 ,  H01L21/60

CPC classification number: H01L24/83 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H01R4/04 ,  H05K1/095 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/28 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith comprises forming three dimensional, essentially square channels (14) interspersed with lands within a dielectric material (12) on a substrate (10). The channels are then filled in one pass with a curable polymeric material (16) containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components (20) are placed to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 一种制造平面的方法，具有包括形成在基底（10）上的介电材料（12）内与土地穿插三维的，实质上方形通道（14）组装有至少一个电子电路元件地下电子电路。 然后，信道被填充在一个道次与含有导电性金属填料的可固化聚合物材料（16）所以没有由该导电材料形成的电路迹线的上表面是在基本上相同的水平为土地的上表面上。 电路部件（20）被放置成接合导电材料。 然后，将可固化材料放置电子元件（一个或多个）之后固化。

公开(公告)号：EP0641019A3

公开(公告)日：1995-12-20

申请号：EP94306334.7

申请日：1994-08-26

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Wong, Chon Meng ,  Iannetta Jr., Roger A.

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A polymer lead frame is made from a flexible substrate (24) with flexible conductive traces (26). The generally square lead frame has diagonal cut-outs (42-48) partially extending from the corners towards the centre, as well as a central hole (62) that lies within a footprint of a die. The die (22) is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive (32). The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterised by a non-planar, non-bumplike surface with concavities having depths of at least one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract translation: 聚合物引线框架由具有柔性导电迹线（26）的柔性衬底（24）制成。 大体上正方形的引线框架具有从角部向中心部分延伸的对角切口（42-48）以及位于模具覆盖区内的中心孔（62）。 模具（22）直接结合到引线框架，优选地用各向异性的导电粘合剂（32）结合。 将模具与引线框一起放置在夹具中。 施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。 该夹具允许组件运输到固化炉并允许施加固化力。 该模具具有接触垫，其特征在于非平面非凸块状表面，其具有深度至少为各向异性导电粘合剂中导电粒子直径的七分之一的凹陷。

公开(公告)号：EP0402546A3

公开(公告)日：1991-12-18

申请号：EP89306621.7

申请日：1989-06-29

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David

IPC: H05K3/12 ,  H05K1/09 ,  H01B1/22 ,  C09D11/00 ,  C09D11/10

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

公开(公告)号：EP0402546A2

公开(公告)日：1990-12-19

申请号：EP89306621.7

申请日：1989-06-29

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David

IPC: H05K3/12 ,  H05K1/09 ,  H01B1/22 ,  C09D11/00 ,  C09D11/10

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

Abstract translation: 生产电路板的方法涉及印刷U.V. 以期望的电路图案将可固化油墨喷涂到基材上，并通过将油墨暴露于脉冲U.V. 源或制作从U.V.准备的电路图案。 将含有磁铁矿颗粒的可固化油墨转变成磁场以将磁铁矿颗粒移动到U.V.的上表面。 可固化油墨。 其他实施例包括根据这些方法制造的电路板以及U.V.的使用。 作为用于容纳电子设备的外壳的屏蔽组合物。

公开(公告)号：EP1246206B1

公开(公告)日：2007-02-28

申请号：EP02012317.0

申请日：1990-11-14

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

IPC: H01B1/22 ,  C09J163/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

公开(公告)号：EP1246206A2

公开(公告)日：2002-10-02

申请号：EP02012317.0

申请日：1990-11-14

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

IPC: H01B1/22 ,  C09J163/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

Abstract translation: 导电水泥其中当用于粘合导电的配合表面提供高湿度条件下是基本上稳定的传导特性; 由载体的没有提供的大于约6.8％的体积收缩率（体积）和导电填料包括团聚颗粒，粉末，薄片，涂覆镍颗粒和涂覆的玻璃球，具有尺寸和表面特征做了保持稳定的电 通过形成具有在电气元件引线的耐潮接触。 具有大于约6.8％（体积）的未固化和固化状态之间的体积收缩的载体显示，以实现使颗粒填料粒子的压实被迫进入增强与所述表面电接触以连接，并提供一种 颗粒本身之间压实措施，以提高颗粒与颗粒的传导。 聚合物载体的压缩下固化场所内部的颗粒用足够的力时的收缩以促使颗粒进入彼此接合以及使颗粒穿透非导电氧化物也可存在于元件引线。

公开(公告)号：EP0641019A2

公开(公告)日：1995-03-01

申请号：EP94306334.7

申请日：1994-08-26

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Wong, Chon Meng ,  Iannetta Jr., Roger A.

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A polymer lead frame is made from a flexible substrate (24) with flexible conductive traces (26). The generally square lead frame has diagonal cut-outs (42-48) partially extending from the corners towards the centre, as well as a central hole (62) that lies within a footprint of a die. The die (22) is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive (32). The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterised by a non-planar, non-bumplike surface with concavities having depths of at least one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract translation: 聚合物引线框架由具有柔性导电迹线（26）的柔性基板（24）制成。 大致正方形的引线框架具有从角部向中心部分延伸的对角线切口（42-48），以及位于模具的占位面积内的中心孔（62）。 模具（22）直接接合到引线框架，优选地与各向异性导电粘合剂（32）结合。 将模具放置在引线框架在夹具中。 施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。 固定装置允许将组件运送到固化炉并允许施加固化力。 模具具有接触垫，其特征在于非平面的非凸起表面，凹凸具有各向异性导电粘合剂中导电颗粒直径的至少七分之一的深度。