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公开(公告)号：US11152534B2
公开(公告)日：2021-10-19
申请号：US16534699
申请日：2019-08-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
IPC: H01L33/00 , H01L27/15 , H01L33/48 , H01L25/075
Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.
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公开(公告)号：US10039160B2
公开(公告)日：2018-07-31
申请号：US15142189
申请日：2016-04-29
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H05B33/0815 , F21K9/00 , F21V23/005 , F21V29/70 , F21Y2115/10 , H05B33/0803 , H05K1/0209 , H05K2201/10106 , Y02B20/341
Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.
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公开(公告)号：US10014455B2
公开(公告)日：2018-07-03
申请号：US14866073
申请日：2015-09-25
Applicant: Point Engineering Co., Ltd.
Inventor： Seung Ho Park , Tae Hwan Song , Sung Hyun Byun
CPC classification number: H01L33/62 , H01L33/486 , H01L33/60 , H05K1/05 , H05K1/185 , H05K2201/09745 , H05K2201/10106
Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.
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公开(公告)号：US20170250333A1
公开(公告)日：2017-08-31
申请号：US15593726
申请日：2017-05-12
Applicant: Point Engineering Co., Ltd.
Inventor： Young Woon Jeon , Tae Hwan Song
IPC: H01L33/64 , H01L33/62 , H01L23/00 , H01L25/075
CPC classification number: H01L33/647 , H01L24/48 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/644 , H01L2224/32225 , H01L2224/32245 , H01L2224/48139 , H01L2224/48227 , H01L2224/48505 , H01L2224/4911 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2924/00014 , H01L2924/10253 , H01L2924/12041 , H01L2924/181 , H05K1/0204 , H05K2201/10106 , H05K2201/10416 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
Abstract: The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.
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公开(公告)号：US09496470B2
公开(公告)日：2016-11-15
申请号：US14986801
申请日：2016-01-04
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/58
Abstract: A chip package has a light shield for blocking the light radiated from the chip. The chip package includes: a chip substrate including a conductive portion and at least one insulating portion electrically separating the conductive portion; an optical device mounted on the chip substrate; a sealing portion sealing the upper surface of the chip substrate; an adhesive bonding the sealing portion to the chip substrate; and a light shield formed in the sealing portion and blocking the light of the optical device from entering into the adhesive.
Abstract translation: 芯片封装具有用于阻挡从芯片辐射的光的遮光罩。 芯片封装包括：芯片基板，包括导电部分和至少一个绝缘部分，电绝缘部分; 安装在芯片基板上的光学装置; 密封所述芯片基板的上表面的密封部; 将密封部分粘合到芯片基板上的粘合剂; 以及形成在密封部分中并阻挡光学装置的光进入粘合剂的遮光罩。
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Patent Agency Ranking
公开(公告)号：US20160197252A1
公开(公告)日：2016-07-07
申请号：US14986801
申请日：2016-01-04
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/58
Abstract: A chip package has a light shield for blocking the light radiated from the chip. The chip package includes: a chip substrate including a conductive portion and at least one insulating portion electrically separating the conductive portion; an optical device mounted on the chip substrate; a sealing portion sealing the upper surface of the chip substrate; an adhesive bonding the sealing portion to the chip substrate; and a light shield formed in the sealing portion and blocking the light of the optical device from entering into the adhesive.
Abstract translation: 芯片封装具有用于阻挡从芯片辐射的光的遮光罩。 芯片封装包括：芯片基板，包括导电部分和至少一个绝缘部分，电绝缘部分; 安装在芯片基板上的光学装置; 密封所述芯片基板的上表面的密封部; 将密封部分粘合到芯片基板上的粘合剂; 以及形成在密封部分中并阻挡光学装置的光进入粘合剂的遮光罩。
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公开(公告)号：US09318679B2
公开(公告)日：2016-04-19
申请号：US14765457
申请日：2014-02-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/62 , H01L33/54 , H01L2224/48091 , H01L2924/00014
Abstract: An optical device includes a metal substrate wherein at least one vertical insulation layer is formed from the upper to the lower surface; a metal plated layer formed on the upper surface of the metal substrate except for the vertical insulation layer; and an optical device chip bonded to one portion of the metal plated layer. One electrode of the optical device chip is electrically connected to a bonded surface of the metal plated layer, and the other electrode of the optical device chip is wire bonded to the other portion of metal plated layer. The optical device chip and a peripheral region thereof is shielded with a sealant, and at least one groove is formed on a partial surface of the metal plated layer so that a portion of the sealant is directly bonded to the metal substrate.
Abstract translation: 光学装置包括金属基板，其中至少一个垂直绝缘层从上表面到下表面形成; 形成在所述金属基板的除了所述垂直绝缘层之外的上表面上的金属镀层; 以及与金属镀层的一部分接合的光学器件芯片。 光器件芯片的一个电极与金属镀层的接合表面电连接，并且光学器件芯片的另一个电极被引线接合到金属镀层的另一部分。 光学元件芯片及其外围区域用密封剂屏蔽，并且在金属镀层的部分表面上形成至少一个凹槽，使得密封剂的一部分直接接合到金属基底。
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18.发明申请Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby 有权制造可封装型光学器件的方法和由此制造的光学器件公开(公告)号：US20150048408A1
公开(公告)日：2015-02-19
申请号：US14349226
申请日：2012-10-04
Applicant: Point Engineering Co., Ltd.
Inventor： Ki Myung Nam , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.
Abstract translation: 本发明涉及一种光学器件的制造方法及其制造的光学器件，其涉及使用基板本身作为散热板，并且采用其上形成有垂直绝缘层的基板，使得电极端子 不必从密封空间挤出，从而能够简化光学装置的整体结构和制造过程。 根据本发明，一种罐封装型光学器件的制造方法包括以下步骤：（a）制备具有垂直绝缘层的金属板和金属基板，其中多于一个的垂直绝缘层与 形成其底面的顶面; （b）用垂直绝缘层将金属板与金属基板的顶面接合; （c）在具有预定深度的圆柱形凹坑形式的步骤（b）中形成空腔，该预定深度通过穿过所述金属板并形成的粘合剂层到达所述金属基板的具有垂直绝缘层的表面 通过所述接合，其中所述空腔在其底壁中包含所述垂直绝缘层; （e）将将光学装置和光学装置的电极电连接在一起的导线分别连接到腔的垂直绝缘层的底壁的表面的任一侧; 和（g）通过由透光材料制成的保护板密封空腔; 以及罐盖，其形成为其顶部中心部分和底部打开并且包围保护板的周边的相框。
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公开(公告)号：US11361575B2
公开(公告)日：2022-06-14
申请号：US16416003
申请日：2019-05-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
IPC: H01L41/187 , H01L41/113 , H01L41/047 , G06V40/13 , B06B1/06
Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.
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公开(公告)号：US10707394B2
公开(公告)日：2020-07-07
申请号：US16235706
申请日：2018-12-28
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
IPC: H01L33/62 , H01L25/075 , H01L27/12 , H01L23/00
Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.
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