公开(公告)号：US20180165499A1

公开(公告)日：2018-06-14

申请号：US15483431

申请日：2017-04-10

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  KUAN-PAO TING

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: The present invention relates to a fingerprint identifying module, including a sensing assembly, a cover, and a metal ring. The cover is provided on the sensing assembly, and includes a protruding portion. The metal ring is sleeved on the cover and the sensing assembly, and includes an accommodation groove and a guide slope. The accommodation groove is provided on an inner side wall of the metal ring, and is configured to accommodate the protruding portion therein, so as to fix the cover on the metal ring. The guide slope is provided on the inner side wall of the metal ring, closes to the accommodation groove, and is configured to contact the protruding portion, so as to assist the protruding portion to move along the guide slope, thereby enabling the protruding portion to enter the accommodation groove.

公开(公告)号：US20180129851A1

公开(公告)日：2018-05-10

申请号：US15400174

申请日：2017-01-06

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  LI-PIN WANG ,  HONG-KAI HUANG ,  CHIH-HAO HSU

IPC: G06K9/00 ,  B05D3/12 ,  B05D3/02 ,  B05D3/06 ,  B05D5/00

CPC classification number: G06K9/00013 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/12 ,  B05D5/00 ,  G06K9/00087 ,  H01L27/14 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.

公开(公告)号：US20180114052A1

公开(公告)日：2018-04-26

申请号：US15367838

申请日：2016-12-02

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  KUAN-PAO TING

IPC: G06K9/00

CPC classification number: G06K9/00087 ,  G06K9/00053

Abstract: A fingerprint identification module includes a fingerprint sensor, a coating structure and a circuit board. The fingerprint sensor is disposed on the circuit board. The coating structure is disposed on the fingerprint sensor. An insulation layer of the coating structure is disposed on the top surface of the fingerprint sensor to isolate electrostatic charges from entering the fingerprint sensor. The coating structure of the fingerprint identification module of the present invention is used for isolating electrostatic charges in replace of the metallic ring of the conventional technology. Consequently, the material cost of the metallic ring is reduced, and the thickness of the fingerprint identification module is reduced.

公开(公告)号：US20180039814A1

公开(公告)日：2018-02-08

申请号：US15292562

申请日：2016-10-13

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  HSIN-TSO CHEN ,  YING-CHIEH CHUANG

IPC: G06K9/00 ,  H04N17/00

CPC classification number: G06K9/00013 ,  G06K9/00087 ,  H04N17/002

Abstract: A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.