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11.
公开(公告)号:EP4466811A1
公开(公告)日:2024-11-27
申请号:EP22854697.4
申请日:2022-12-21
Applicant: QUALCOMM INCORPORATED
Inventor: XU, Huilin , JI, Lianghai , MA, Liangping , WU, Qiang , GURELLI, Mehmet Izzet , MA, Jun , DUAN, Weimin , ANANTHA SWAMY, Karthik
IPC: H04L1/00 , H04W52/22 , H04B7/06 , H04B17/373
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公开(公告)号:EP4413790A1
公开(公告)日:2024-08-14
申请号:EP22785832.1
申请日:2022-09-09
Applicant: QUALCOMM INCORPORATED
Inventor: JI, Lianghai , WU, Qiang , XU, Huilin , MA, Jun , GURELLI, Mehmet Izzet , DUAN, Weimin , ANANTHA SWAMY, Karthik
CPC classification number: H04W56/0045 , H04W76/14 , H04W76/11 , H04W76/19 , H04W76/40 , H04W72/40 , H04W72/121
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公开(公告)号:EP4490856A1
公开(公告)日:2025-01-15
申请号:EP23710167.0
申请日:2023-02-10
Applicant: QUALCOMM INCORPORATED
Inventor: DUAN, Weimin , XU, Huilin , JI, Lianghai , GURELLI, Mehmet Izzet , MA, Jun , WU, Qiang , RAMASAMY, Bala , ANANTHA SWAMY, Karthik
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14.
公开(公告)号:EP4476994A1
公开(公告)日:2024-12-18
申请号:EP22840536.1
申请日:2022-12-01
Applicant: QUALCOMM INCORPORATED
Inventor: JI, Lianghai , XU, Huilin , SAYED HASSAN, Mohamad , MA, Liangping , MA, Jun , WU, Qiang , GURELLI, Mehmet Izzet , DUAN, Weimin , ANANTHA SWAMY, Karthik
IPC: H04W72/04 , H04W72/231 , H04W72/232
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公开(公告)号:EP4434167A1
公开(公告)日:2024-09-25
申请号:EP22802372.7
申请日:2022-10-13
Applicant: QUALCOMM INCORPORATED
Inventor: JI, Lianghai , XU, Huilin , MA, Liangping , WU, Qiang , MA, Jun , GURELLI, Mehmet Izzet , DUAN, Weimin , ANANTHA SWAMY, Karthik
CPC classification number: H04B7/0695 , H04B7/088
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公开(公告)号:EP4420436A1
公开(公告)日:2024-08-28
申请号:EP22790129.5
申请日:2022-09-22
Applicant: QUALCOMM INCORPORATED
Inventor: JI, Lianghai , XU, Huilin , WU, Qiang , MA, Jun , GURELLI, Mehmet Izzet , DUAN, Weimin , ANANTHA SWAMY, Karthik
IPC: H04W56/00
CPC classification number: H04W56/0015 , H04W56/002 , H04W56/0025
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公开(公告)号:EP4490857A1
公开(公告)日:2025-01-15
申请号:EP23710949.1
申请日:2023-02-10
Applicant: QUALCOMM INCORPORATED
Inventor: DUAN, Weimin , JI, Lianghai , XU, Huilin , MA, Liangping , GURELLI, Mehmet Izzet , WU, Qiang , ANANTHA SWAMY, Karthik
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18.
公开(公告)号:EP4480211A1
公开(公告)日:2024-12-25
申请号:EP22926375.1
申请日:2022-02-15
Applicant: QUALCOMM INCORPORATED
Inventor: XU, Huilin , MA, Jun , WU, Qiang , GURELLI, Mehmet Izzet , DUAN, Weimin , REN, Yuwei , SAYED HASSAN, Mohamad , JI, Lianghai , ANANTHA SWAMY, Karthik
IPC: H04W24/10 , H04B17/345
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公开(公告)号:EP4460909A1
公开(公告)日:2024-11-13
申请号:EP22844411.3
申请日:2022-12-08
Applicant: QUALCOMM INCORPORATED
Inventor: XU, Huilin , JI, Lianghai , MA, Liangping , HUANG, Fei , GURELLI, Mehmet, Izzet , DUAN, Weimin , WU, Qiang , MA, Jun , ANANTHA SWAMY, Karthik
IPC: H04B7/10 , H04B7/06 , H04B17/309 , H04L5/00
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20.
公开(公告)号:EP4399929A1
公开(公告)日:2024-07-17
申请号:EP22758053.7
申请日:2022-07-11
Applicant: QUALCOMM INCORPORATED
Inventor: JI, Lianghai , WU, Qiang , GURELLI, Mehmet Izzet , DUAN, Weimin , ANANTHA SWAMY, Karthik
IPC: H04W72/23
CPC classification number: H04W74/0833 , H04W76/14 , H04W92/18 , H04W88/04 , H04L5/0053 , H04W28/0278 , H04B7/18513 , H04L5/0091 , H04L5/14 , H04L5/1469 , H04L5/0048 , H04L5/0023 , H04L5/001 , H04L5/0033 , H04L5/0044 , H04W28/0865 , H04W72/40 , H04W72/25 , H04W72/20
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