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公开(公告)号:EP4128874A1
公开(公告)日:2023-02-08
申请号:EP21720638.2
申请日:2021-03-31
Applicant: QUALCOMM INCORPORATED
Inventor: DALMIYA, Vishal , CHEN, Xing , BALASUBRAMANIAN, Arun Prasanth , RAO, Vaishakh , ZACHARIAS, Leena , KUMAR, Vanitha Aravamudhan , MAHESHWARI, Shailesh , LEE, Kuo-Chun
IPC: H04W28/14 , H04L12/801 , H04L12/24
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12.
公开(公告)号:EP4473771A1
公开(公告)日:2024-12-11
申请号:EP23706221.1
申请日:2023-01-17
Applicant: QUALCOMM INCORPORATED
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公开(公告)号:EP4423938A1
公开(公告)日:2024-09-04
申请号:EP22794012.9
申请日:2022-09-27
Applicant: QUALCOMM INCORPORATED
Inventor: KUMAR, Akshay , MEYLAN, Arnaud , BALASUBRAMANIAN, Arun Prasanth , THIRUKANNAN, Karthik , MAHESHWARI, Shailesh , KUMAR, Vanitha Aravamudhan
CPC classification number: H04L1/1848 , H04L1/1893 , H04L1/1685
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公开(公告)号:EP3603205A1
公开(公告)日:2020-02-05
申请号:EP18711734.6
申请日:2018-02-27
Applicant: Qualcomm Incorporated
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公开(公告)号:EP4367928A1
公开(公告)日:2024-05-15
申请号:EP22757782.2
申请日:2022-07-01
Applicant: QUALCOMM Incorporated
Inventor: DALMIYA, Vishal , RAO, Vaishakh , NALLAMANTI, Sathish Kumar , BELLAM, Krishna Chaitanya , ADIREDDY, Gautham Kumar Reddy , ZACHARIAS, Leena , LEE, Kuo-Chun , KUMAR, Vanitha Aravamudhan
IPC: H04W28/08
CPC classification number: H04W28/08
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公开(公告)号:EP4143989A1
公开(公告)日:2023-03-08
申请号:EP21726756.6
申请日:2021-04-28
Applicant: QUALCOMM INCORPORATED
Inventor: KUMAR, Vanitha Aravamudhan , CHIN, Tom , CHRISTOL, Thomas , QAZI, Uzma Khan
IPC: H04B7/08
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公开(公告)号:EP3963958A1
公开(公告)日:2022-03-09
申请号:EP20727040.6
申请日:2020-04-29
Applicant: QUALCOMM INCORPORATED
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