公开(公告)号：WO2020236324A1

公开(公告)日：2020-11-26

申请号：PCT/US2020/026714

申请日：2020-04-03

Applicant: RAYTHEON COMPANY ,  UNIVERSITY OF MASSACHUSETTS

Inventor： KLEK, Erika C. ,  HERNDON, Mary K. ,  SIKINA, Thomas V. ,  BENEDICT, James E. ,  SOUTHWORTH, Andrew R. ,  WILDER, Kevin M. ,  RANASINGHA, Oshadha K. ,  AKYURTLU, Alkim

IPC: H01C17/065 ,  H01C17/30 ,  H01C17/24 ,  H01C7/00

Abstract: A method includes blending (302) a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink (210). The method also includes printing (304) the modified carbon-based ink onto a structure (104, 106, 108). The method further includes curing (306) the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing (308) the cured printed modified carbon-based ink to form a thick film resistor (102). An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

公开(公告)号：WO2019094373A3

公开(公告)日：2019-05-16

申请号：PCT/US2018/059410

申请日：2018-11-06

Applicant: RAYTHEON COMPANY

Inventor： ADAMS, Peter J. ,  SIKINA, Thomas V. ,  HAVEN, John P. ,  BENEDICT, James E.

IPC: H05K3/40 ,  H05K3/42 ,  H01P5/02 ,  H01P1/04 ,  H01Q9/27 ,  H05K1/02

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：EP3970167A1

公开(公告)日：2022-03-23

申请号：EP20723626.6

申请日：2020-04-03

Applicant: Raytheon Company ,  University Of Massachusetts

Inventor： KLEK, Erika C. ,  HERNDON, Mary K. ,  SIKINA, Thomas V. ,  BENEDICT, James E. ,  SOUTHWORTH, Andrew R. ,  WILDER, Kevin M. ,  RANASINGHA, Oshadha K. ,  AKYURTLU, Alkim

IPC: H01C17/065 ,  H01C17/30 ,  H01C17/24 ,  H01C7/00

公开(公告)号：EP3760014A1

公开(公告)日：2021-01-06

申请号：EP19710905.1

申请日：2019-02-27

Applicant: Raytheon Company

Inventor： SIKINA, Thomas V. ,  BENEDICT, James E. ,  HAVEN, John P. ,  SOUTHWORTH, Andrew R. ,  AZADZOI, Semira M.

IPC: H05K1/02 ,  H05K3/40 ,  H01R13/62 ,  H01P11/00 ,  H05K1/14

公开(公告)号：EP3707974A2

公开(公告)日：2020-09-16

申请号：EP18836674.4

申请日：2018-11-06

Applicant: Raytheon Company

Inventor： ADAMS, Peter J. ,  SIKINA, Thomas V. ,  HAVEN, John P. ,  BENEDICT, James E.

IPC: H05K3/40 ,  H05K3/42 ,  H01P5/02 ,  H01P1/04 ,  H01Q9/27 ,  H05K1/02

公开(公告)号：EP4235951A3

公开(公告)日：2023-09-06

申请号：EP23174882.3

申请日：2018-11-05

Applicant: Raytheon Company

Inventor： HAVEN, John P. ,  SIKINA, Thomas V. ,  ADAMS, Peter J. ,  BENEDICT, James E.

IPC: H01Q13/18 ,  H01Q1/52 ,  H01P1/04

Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.

公开(公告)号：EP4235951A2

公开(公告)日：2023-08-30

申请号：EP23174882.3

申请日：2018-11-05

Applicant: Raytheon Company

Inventor： HAVEN, John P. ,  SIKINA, Thomas V. ,  ADAMS, Peter J. ,  BENEDICT, James E.

IPC: H01P1/04

Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.

公开(公告)号：EP4305709A1

公开(公告)日：2024-01-17

申请号：EP22711774.4

申请日：2022-03-03

Applicant: Raytheon Company

Inventor： SIKINA, Thomas V. ,  FAVREAU, Channing P. ,  KLEK, Erika

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/52 ,  H01Q21/24

公开(公告)号：EP3178178B1

公开(公告)日：2018-10-24

申请号：EP15729713.6

申请日：2015-06-05

Applicant: Raytheon Company

Inventor： SIKINA, Thomas V. ,  SCHUSS, Jack J. ,  HILLIARD, Joseph E. Jr.

IPC: H04B17/00 ,  H04B17/21 ,  H04B7/08 ,  H01Q3/26 ,  G01D18/00 ,  H04B5/00

CPC classification number: H04B5/0043 ,  G01D18/00 ,  H01Q3/267 ,  H04B7/0865 ,  H04B17/0085 ,  H04B17/21

Abstract: Described embodiments calibrate an array antenna using near-field antenna measurements individually for each antenna element in an antenna under test (AUT). A signal is received at a first AUT antenna element from an antenna probe assembly by transmitting from the antenna probe assembly at each of multiple known probe locations in a near-field of the AUT. A signal is received at each probe location by transmitting from the first antenna element of the AUT to the antenna probe assembly. The received signals are combined into a combined signal for the first antenna element that de-correlates multi-path in the combination result. The combined signal is processed to generate a calibration coefficient for the first AUT antenna element. Remote boundary condition (RBC) testing is performed to reduce temporal instability. The multiple known probe locations lie on one of the following: a planar surface, a cylindrical surface, and a spherical surface.

公开(公告)号：EP4104243A1

公开(公告)日：2022-12-21

申请号：EP21704114.4

申请日：2021-01-13

Applicant: Raytheon Company

Inventor： SCHUSS, Jack J. ,  THIESSEN, Phillip W. ,  SIKINA, Thomas V.

IPC: H01Q1/52 ,  H01Q5/42 ,  H01Q15/00 ,  H01Q21/06 ,  H01Q21/30