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公开(公告)号：WO2021162818A1
公开(公告)日：2021-08-19
申请号：PCT/US2021/013314
申请日：2021-01-13
Applicant: RAYTHEON COMPANY
Inventor： SCHUSS, Jack J. , THIESSEN, Phillip W. , SIKINA, Thomas V.
Abstract: A dual band frequency selective radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a frequency selective surface (FSS) tuned to the high band radar signals forming a surface of the low band radiator array and passes the high band radar signals to the high band radiator array; and a single aperture disposed in front of the low band radiator array, the high band radiator array and the FSS for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals.
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公开(公告)号：WO2021030425A1
公开(公告)日：2021-02-18
申请号：PCT/US2020/045908
申请日：2020-08-12
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENEDICT, James E. , SOUTHWORTH, Andrew R. , SIKINA, Thomas V. , WILDER, Kevin , SOUZA, Matthew , TORBERG, Aaron Michael
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (RGB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the RGB, solder an end of the segment of copper wire to a signal trace of the RGB, and flush cut an opposite end of the segment of the copper wire to a surface of the RGB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：WO2021162817A1
公开(公告)日：2021-08-19
申请号：PCT/US2021/013313
申请日：2021-01-13
Applicant: RAYTHEON COMPANY
Inventor： SCHUSS, Jack J. , THIESSEN, Phillip W. , SIKINA, Thomas V.
Abstract: A dual band dipole radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a foam material between the low band radiator array and the high band radiator array for support; and a single aperture for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals, where the low band radiator array is comprised of a plurality of dipole structures disposed within the foam material and tuned to pass through high band radar signals to or from the high band radiator array.
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公开(公告)号：WO2021041197A1
公开(公告)日：2021-03-04
申请号：PCT/US2020/047363
申请日：2020-08-21
Applicant: RAYTHEON COMPANY
Inventor： WILDER, Kevin , SMITH, Alan C. , BENEDICT, James , SOUTHWORTH, Andrew , SIKINA, Thomas V. , HERNDON, Mary K. , HAVEN, John P.
Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (RGBs). The first RGB (110) includes a first trace (111), ground planes (112,113) at opposite sides of the first trace (111), dielectric material (114) interposed between the first trace (111) and the ground planes (112,113) and a first end. The first end is formed as a first rabbet (117) at which the first trace (111) is exposed. The second PCB (120) includes a second trace (121), ground planes (122,123) at opposite sides of the second trace (121), dielectric material (124) interposed between the second trace (121) and the ground planes (122,123) and a second end. The second end is formed as a second rabbet (127), which is substantially identical to the first rabbet (117), at which the second trace (121) is exposed. The first and second ends are mated in a shiplap joint (401) to electrically couple the first (111) and second (121) traces.
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公开(公告)号：WO2019168992A1
公开(公告)日：2019-09-06
申请号：PCT/US2019/019847
申请日：2019-02-27
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas V. , BENEDICT, James E. , HAVEN, John P. , SOUTHWORTH, Andrew R. , AZADZOI, Semira M.
Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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Patent Agency Ranking
公开(公告)号：WO2021201969A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/016294
申请日：2021-02-03
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James E. , DANELLO, Paul A. , PEVZNER, Mikhail , SIKINA, Thomas V. , SOUTHWORTH, Andrew R.
IPC: H05K3/40 , H01L2224/11602 , H01L2224/45147 , H01L2224/73207 , H01L24/11 , H01L24/45 , H01L24/73 , H05K2201/10287 , H05K2203/0257 , H05K2203/166 , H05K3/26 , H05K3/4007 , H05K3/4046 , H05K3/465 , H05K3/4679
Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.
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公开(公告)号：WO2021146514A1
公开(公告)日：2021-07-22
申请号：PCT/US2021/013569
申请日：2021-01-15
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas V. , HAVEN, John P. , FAGERLUND, Gregory M. , BENEDICT, James , SOUTHWORTH, Andrew , WILDER, Kevin
IPC: H01Q21/06 , H01Q1/22 , H01Q21/00 , B33Y80/00 , H01Q1/2283 , H01Q1/38 , H01Q21/0025 , H01Q21/065 , H01Q9/045
Abstract: An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.
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公开(公告)号：WO2019094373A2
公开(公告)日：2019-05-16
申请号：PCT/US2018/059410
申请日：2018-11-06
Applicant: RAYTHEON COMPANY
Inventor： ADAMS, Peter J. , SIKINA, Thomas V. , HAVEN, John P. , BENEDICT, James E.
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：WO2022192053A1
公开(公告)日：2022-09-15
申请号：PCT/US2022/018601
申请日：2022-03-03
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas V. , FAVREAU, Channing P. , KLEK, Erika
Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.
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公开(公告)号：WO2021188657A1
公开(公告)日：2021-09-23
申请号：PCT/US2021/022742
申请日：2021-03-17
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James , KLEK, Erika , HAVEN, John P. , SOULIOTIS, Michael , SIKINA, Thomas V. , SOUTHWORTH, Andrew R. , WILDER, Kevin
Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstripto-stripline transition element operably connectable to the microstrip interface and to the stripline interface.
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